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公开(公告)号:US20140285576A1
公开(公告)日:2014-09-25
申请号:US13849109
申请日:2013-03-22
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Rio Rivas , Kellie Susanne Jensen , T. Stafford Johnson
CPC classification number: B41J2/155 , B41J2/04541 , B41J2/0455 , B41J2/0457 , B41J2/04581 , B41J2/14024 , B41J2/1433 , B41J2002/14491 , B41J2202/20
Abstract: In one example, a printhead structure includes a cover covering an underlying structure. The cover and the underlying structure define multiple chambers from which fluid may be dispensed through nozzles in the cover and the cover has a stepped edge profile along at least part of the perimeter of the cover.
Abstract translation: 在一个示例中,打印头结构包括覆盖下面的结构的盖。 盖和下面的结构限定多个室,通过盖中的喷嘴可以从中分配流体,并且盖沿着盖的周边的至少一部分具有阶梯状边缘轮廓。
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公开(公告)号:US20190119101A1
公开(公告)日:2019-04-25
申请号:US16068261
申请日:2016-06-24
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. , The State of Oregon State Board of Higher Education on behalf of Oregon State University
Inventor: James Elmer Abbott, Jr. , John M McGlone , Kristopher Olsen , Roberto A Pugliese , Greg Scott Long , John Wager , Douglas A Keszler , T. Stafford Johnson , William F Stickel
Abstract: An amorphous thin film stack can include a first layer including a combination metals or metalloids including: 5 at % to in 90 at % of a metalloid; 5 at % to 90 at % of a first metal and a second metal independently selected from titanium, vanadium, chromium, iron, cobalt, nickel, niobium, molybdenum, ruthenium, rhodium, palladium, tantalum, tungsten, osmium, iridium, or platinum. The three elements may account for at least 70 at % of the amorphous thin film stack. The stack can further include a second layer formed on a surface of the first layer. The second layer can be an oxide layer, a nitride layer, or a combination thereof. The second layer can have an average thickness of 10 angstroms to 200 microns and a thickness variance no greater than 15% of the average thickness of the second layer.
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