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    FLUID EJECTION DEVICES WITH PARTICLE TOLERANT THIN-FILM EXTENSIONS
    2.
    发明申请
    FLUID EJECTION DEVICES WITH PARTICLE TOLERANT THIN-FILM EXTENSIONS 有权
    具有颗粒稳定薄膜扩展的流体喷射装置

    公开(公告)号：US20160082732A1

    公开(公告)日：2016-03-24

    申请号：US14958870

    申请日：2015-12-03

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Rio Rivas ,  Ed Friesen ,  Kellie Susanne Jensen

    IPC: B41J2/14

    CPC classification number: B41J2/14427 ,  B41J2/1404 ,  B41J2/14201 ,  B41J2/1433 ,  B41J2002/14403 ,  B41J2002/14467

    Abstract: Fluid ejection devices with particle tolerant thin-film extensions are disclosed. An example apparatus includes a printer; a reservoir; and a printhead including: a firing chamber; a channel to receive fluid from the reservoir, the channel is coupled to the firing chamber, the channel having an opening; and a particle-tolerant film disposed adjacent the opening of the channel, the particle-tolerant film disposed between the channel and the reservoir, the particle-tolerant film to deter particles within the fluid from settling in an area adjacent the opening.

    Abstract translation: 公开了具有耐磨薄膜延伸的流体喷射装置。 示例性装置包括打印机; 一个水库 和一个打印头，包括：一个喷射室; 用于从贮存器接收流体的通道，所述通道联接到所述燃烧室，所述通道具有开口; 以及邻近通道的开口设置的耐颗粒膜，设置在通道和储存器之间的耐颗粒膜，用于阻止流体中的颗粒沉积在邻近开口的区域中的耐颗粒膜。

    FLUIDIC DIES WITH BEVELED EDGES UNDERNEATH ELECTRICAL LEADS
    6.
    发明申请
    FLUIDIC DIES WITH BEVELED EDGES UNDERNEATH ELECTRICAL LEADS 有权

    公开(公告)号：US20210170746A1

    公开(公告)日：2021-06-10

    申请号：US16760923

    申请日：2018-01-23

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Stan E. Leigh ,  Kellie Susanne Jensen ,  Terry McMahon ,  Donald W. Schulte

    IPC: B41J2/14 ,  B41J2/175

    Abstract: In one example in accordance with the present disclosure, a fluidic die is described. The fluidic die includes a surface on which a number of nozzles are formed. An electrical interface on the fluidic die establishes an electrical connection between the fluidic die and a fluidic die controller. The electrical interface includes 1) a bond pad disposed within a bond pad region of the surface and 2) an electrical lead coupled to the bend pad to establish an electrical connection between the fluidic die and the fluidic die controller. The fluidic die also includes a beveled edge along an edge of the surface underneath the electrical lead.

    PRINTHEAD DIE WITH MULTIPLE TERMINATION RINGS
    7.
    发明申请
    PRINTHEAD DIE WITH MULTIPLE TERMINATION RINGS 有权
    带多个终止环的头巾

    公开(公告)号：US20150352843A1

    公开(公告)日：2015-12-10

    申请号：US14762958

    申请日：2013-01-23

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Anthony M. Fuller ,  Rio Rivas ,  Kellie Susanne Jensen

    IPC: B41J2/14

    CPC classification number: B41J2/1433 ,  B41J2/14129 ,  B41J2202/13 ,  C23C28/32 ,  C23C28/321 ,  C23C28/34 ,  C23C28/341 ,  C23C28/345

    Abstract: A printhead die includes a SiO2 layer grown into a surface of a silicon substrate, and a dielectric layer deposited onto an interior surface area of a substrate. Multiple termination rings are formed around the interior surface area. Each ring is defined by an absence of the dielectric layer. A berm is located in between each termination ring. Each berm is defined by the presence of the dielectric layer.

    Abstract translation: 打印头芯片包括生长在硅衬底的表面中的SiO 2层和沉积在衬底的内表面区域上的介电层。 在内表面区域周围形成多个端接环。 每个环由不存在电介质层限定。 每个终端环之间都设有护堤。 每个护堤由介电层的存在来定义。

    FLUID EJECTION DEVICE WITH PARTICLE TOLERANT THIN-FILM EXTENSION
    8.
    发明申请
    FLUID EJECTION DEVICE WITH PARTICLE TOLERANT THIN-FILM EXTENSION 有权
    具有颗粒稳定薄膜延伸的流体喷射装置

    公开(公告)号：US20150124024A1

    公开(公告)日：2015-05-07

    申请号：US14397151

    申请日：2012-07-24

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Rio Rivas ,  Ed Friesen ,  Kellie Susanne Jensen

    IPC: B41J2/14

    CPC classification number: B41J2/14427 ,  B41J2/1404 ,  B41J2/14201 ,  B41J2/1433 ,  B41J2002/14403 ,  B41J2002/14467

    Abstract: In an embodiment, a fluid ejection device includes a thin-film layer formed over a substrate, a chamber layer formed over the thin-film layer, the chamber layer defining a fluidic channel that leads to a firing chamber, a slot extending through the substrate and into the chamber layer through an ink feed hole in the thin-film layer, and a particle tolerant thin-film extension of the thin-film layer that protrudes into the slot from between the substrate and the chamber layer.

    Abstract translation: 在一个实施例中，流体喷射装置包括在衬底上形成的薄膜层，形成在薄膜层上的室层，室层限定通向烧制室的流体通道，延伸穿过衬底的槽 并通过薄膜层中的供墨孔进入腔室层，以及从衬底和室层之间突出到槽中的薄膜层的耐粒子薄膜延伸。

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