-
Patent Agency Ranking
公开(公告)号：US20240418459A1
公开(公告)日：2024-12-19
申请号：US18704249
申请日：2021-10-27
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Wei HUANG , Thomas Craig ANTHONY , Harish IRRINKI , Ben PON
Abstract: Examples of lattice structures are described herein. In some examples, a heat exchanger may include a three-dimensional (3D) lattice structure. In some examples, the heat exchanger may include a spiral structure transecting the 3D lattice structure. In some examples, the spiral structure is to mix fluid to pass through the 3D lattice structure.
-
公开(公告)号：US20240149346A1
公开(公告)日：2024-05-09
申请号：US18282168
申请日：2021-03-26
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Thomas Craig ANTHONY , Elizabeth GALATI , Kyle WYCOFF , John Samuel Dilip JANGAM
Abstract: The present disclosure describes three-dimensional printing kits, three-dimensional printing systems, and methods of making three-dimensional printed objects. In one example, a three-dimensional printing kit can include a build material and a binding agent. The build material can include particles of copper or a copper alloy. The binding agent can include water, copper (II) nitrate or a hydrate thereof, and a reaction inhibition additive. The additive can be a copper oxide etchant, a water-soluble phosphate-containing compound, or a combination thereof.
-
公开(公告)号：US20230382043A1
公开(公告)日：2023-11-30
申请号：US18030691
申请日：2021-09-29
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Thomas Craig ANTHONY , Richard LAUCOURNET , Blandine CASTAY
IPC: B29C64/245 , B29C64/165 , B22F10/14 , B22F10/47 , B33Y10/00 , B33Y30/00
CPC classification number: B29C64/245 , B29C64/165 , B22F10/14 , B22F10/47 , B33Y10/00 , B33Y30/00
Abstract: In one example in accordance with the present disclosure, an additive manufacturing stage is described. The additive manufacturing stage includes a bed to define a volume where a three-dimensional object is to be formed. The additive manufacturing stage also includes an air-permeable platform on which build material is deposited. A vacuum system draws air resident in the build material down through the air-permeable platform.
-
公开(公告)号：US20240082918A1
公开(公告)日：2024-03-14
申请号：US18271657
申请日：2021-01-15
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： John Samuel Dilip JANGAM , Thomas Craig ANTHONY , Lihua ZHAO
Abstract: A three-dimensional printing kit can include a particulate build material with from about 80 wt % to 100 wt % copper-containing build particles having a D50 particle size distribution value from about 1 μm to about 150 μm, a binding agent including a build binder to apply to particulate build material layers to form a green body object, and a shaping composition to apply to a surface of the green body object and to control green body object deformation. The shaping composition can include from about 10 wt % to about 80 wt % liquid vehicle and from about 20 wt % to about 90 wt % metal shaping particles having a D50 particle size distribution value from about 100 nm to about 100 μm. The metal shaping particles can be smaller than the copper-containing build particles.
-
公开(公告)号：US20240008187A1
公开(公告)日：2024-01-04
申请号：US18039379
申请日：2020-12-01
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Elizabeth Ann GALATI , John Samuel Dilip JANGAM , Thomas Craig ANTHONY , Aja Pariante HARTMAN , Kristopher J. ERICKSON
CPC classification number: H05K3/105 , H05K1/097 , H05K2203/125 , H05K2203/0783
Abstract: The present disclosure relates to a conductive trace precursor composition comprising a metal salt; 3 to 15 weight % of a reducing solvent selected from a lactam and/or a polyol, and water. Where the reducing solvent is 2-pyrrolidinone, the 2-pyrrolidinone is not present in an amount of 5 weight % or in an amount of 7.5 weight % of the conductive trace precursor composition.
-
-
-
-
Search Results
5
records
(took 0.043 seconds)
