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公开(公告)号:US20210197455A1
公开(公告)日:2021-07-01
申请号:US16077752
申请日:2017-07-14
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Shannon Reuben WOODRUFF , Ali EMAMJOMEH , Yi FENG , Erica FUNG , Carolin FLEISCHMANN , Geoffrey SCHMID
IPC: B29C64/165 , B33Y70/00
Abstract: This disclosure relates to a method of 3-D printing comprising: applying a layer of build material onto a print platform, wherein the build material comprises particles of a polymer comprising polymer chains having at least one reactive group that is protected with a protecting group; printing a de-protecting agent at selected locations on the layer of build material; and coalescing particles of the polymer at the printed locations on the layer of build material to form a coalesced polymer layer.
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公开(公告)号:US20190054690A1
公开(公告)日:2019-02-21
申请号:US16074492
申请日:2016-12-08
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Yi FENG , Jesiska TANDY , Rachael DONOVAN
IPC: B29C64/165 , B29C64/20 , B29C64/314 , B33Y30/00 , B33Y70/00
Abstract: A material set can include a powder bed material, including a polymer powder and a fusing agent. The polymer powder can have a particle size distribution having the following profile: D10 of 30 μm or more, D50 from 50 μm to 65 μm, and D90 of 100 ? m or less. Other parameters can include a melting point from 100° C. to 300° C., a processing window temperature of 20° C. or more, an energy density absorption of 20% or less, and a melt flow index from 10 cc to 80 cc at 10 minutes. The fusing agent can include an energy absorber capable of absorbing electromagnetic radiation to produce heat.
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公开(公告)号:US20190030802A1
公开(公告)日:2019-01-31
申请号:US16073278
申请日:2016-05-13
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Yi FENG , Erica Montei FUNG , Michael A. NOVICK
IPC: B29C64/165 , C08K3/04
Abstract: The present disclosure is drawn to material sets for 3-dimensional printing, 3-dimensional printing systems, and 3-dimensional printed parts. A material set can include a polyamide polymer powder having an average particle size from 20 μm to 120 μm and a fusing agent. The polyamide-11 can have a solution viscosity from 1.5 to 1.75 at room temperature, and may increase by no more than 5% after exposure to 180° C. for 20 hours. The fusing agent can include an energy absorber capable of absorbing electromagnetic radiation to produce heat.
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