公开(公告)号：US20210402782A1

公开(公告)日：2021-12-30

申请号：US16603821

申请日：2018-04-15

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, LP.

Inventor： Anthony M. Fuller ,  Michael W. Cumbie ,  Chien-Hua Chen

IPC: B41J2/175 ,  H01L23/544

Abstract: A circuit die may include an outermost circuit layer having electrical transmission routing and an alignment target overlying the outermost circuit layer.

公开(公告)号：US20210283910A1

公开(公告)日：2021-09-16

申请号：US16465220

申请日：2017-03-15

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY LP.

Inventor： Chien-Hua Chen ,  Michael w. Cumble

IPC: B41J2/14

Abstract: A fluid ejection device may include a fluid ejection die embedded in a moldable material, a number of fluid actuators within the fluid ejection die to recirculate fluid within a number of firing chambers of the fluid ejection die, and a number of cooling channels defined in the moldable material thermally coupled to the fluid ejection die.

公开(公告)号：US20180134038A1

公开(公告)日：2018-05-17

申请号：US15570785

申请日：2015-05-15

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, LP.

Inventor： Chien-Hua Chen ,  Gary G. Lutnesky ,  Michael W. Cumbie

IPC: B41J2/14 ,  B41J2/21 ,  B41J2/155 ,  B41J2/16

CPC classification number: B41J2/14145 ,  B41J2/14072 ,  B41J2/14201 ,  B41J2/155 ,  B41J2/1601 ,  B41J2/1603 ,  B41J2/1607 ,  B41J2/1632 ,  B41J2/1634 ,  B41J2/2103 ,  B41J2002/14419 ,  B41J2202/11 ,  B41J2202/13

Abstract: A fluid ejection die is described. The fluid ejection die comprises at least one nozzle to dispense fluid and is coupled to support manifold. The support manifold has at least one channel passing therethrough to communicate fluid to the fluid ejection die for dispensation. The at least one channel has a fluid contact surface, and the support manifold comprises at least one recessed structure that is spaced apart from the fluid contact surface.