公开(公告)号：US11702516B2

公开(公告)日：2023-07-18

申请号：US16769762

申请日：2018-12-20

Applicant: HEXCEL COMPOSITES LIMITED

Inventor： David Allan Tilbrook ,  Christopher Robert Mason ,  Martin Richard Simmons

IPC: C08J3/24 ,  C08G59/50 ,  C08K9/10 ,  C08L63/00 ,  C08J5/24 ,  C08K5/3445 ,  C08K5/13 ,  C08K5/09

CPC classification number: C08J3/241 ,  C08G59/50 ,  C08J5/243 ,  C08K5/09 ,  C08K5/13 ,  C08K5/3445 ,  C08K9/10 ,  C08L63/00 ,  C08J2363/00

Abstract: This invention relates to a curative composition and its use in curing epoxy resins and prepregs, adhesives and moulded materials derived therefrom. The curative composition comprises a clathrate comprising a host component and a guest component, the host comprising a carboxylic acid or ester compounds as defined or phenolphthalin and the guest comprising an imidazole or imidazoline component.