公开(公告)号：US20250090822A1

公开(公告)日：2025-03-20

申请号：US18292103

申请日：2022-08-19

Applicant: HISAMITSU PHARMACEUTICAL CO., INC.

Inventor： Tetsuji KUWAHARA ,  Keiichiro TSURUSHIMA ,  Masafumi ONO ,  Masato WAKAMATSU ,  Tetsuro TATEISHI

IPC: A61M37/00 ,  A61K9/00 ,  A61K47/32

Abstract: A microneedle patch according to one example includes a backing, an adhesive layer provided on the main surface of the backing, and a microneedle array at least a part of which is positioned within the adhesive layer, wherein the adhesive layer includes a water-soluble polymer and water, and a loss tangent of the adhesive layer under measurement conditions of an environmental temperature of 25° C. and a frequency of 1 Hz is 0.20 to 0.41.