-
公开(公告)号：US11990725B2
公开(公告)日：2024-05-21
申请号：US17475775
申请日：2021-09-15
Inventor： Dan Li , Mengbo Fu , Qinhao Fu , Yifan Xie , Tengfei Wang
CPC classification number: H01S3/0405 , G02B6/4206 , G02B6/4271 , G02B6/428 , H04B10/503
Abstract: An optical module includes a shell, a circuit board and an optical transmitter device. The circuit board is disposed in the shell. The optical transmitter device is disposed in the shell, and includes a plate-shaped substrate and a laser assembly. The laser assembly is disposed on a surface of the substrate, is electrically connected to the circuit board, and is configured to emit an optical signal. The substrate is fixedly connected to an end of the circuit board.
-
Patent Agency Ranking
公开(公告)号：US11828993B2
公开(公告)日：2023-11-28
申请号：US17162173
申请日：2021-01-29
CPC classification number: G02B6/4256 , H04B10/50 , H04B10/60
Abstract: An optical sub-module includes a first casing, a second casing, an adhesive layer and an optical device. The first casing has a top wall and a first sidewall. The second casing has a bottom wall and a second sidewall. A height of the second sidewall in a thickness direction of the bottom wall is greater than a height of the first sidewall in a thickness direction of the top wall, and the second casing and the first casing is connected to form a chamber. The adhesive layer is disposed between a surface of the first sidewall and a surface of the second sidewall, and a coefficient of thermal expansion of the adhesive layer is greater than a coefficient of thermal expansion of the first casing and a coefficient of thermal expansion of the second casing. The optical device is disposed in the chamber and fixedly connected to the second casing.
-
公开(公告)号：US11994726B2
公开(公告)日：2024-05-28
申请号：US17853792
申请日：2022-06-29
Inventor： Honghao Zhang , Benzheng Dong , Yifan Xie , Kai Liu , Qinhao Fu , Dan Li , Tengfei Wang
CPC classification number: G02B6/4246 , G02B6/4269 , G02B6/4292 , H04B10/40
Abstract: The present disclosure discloses an optical module including: a circuit board; a housing assembly divided by a separation board into a first portion and a second portion that are stacked one above the other, wherein a light-emitting cavity is formed in the second portion, and a partition wall is provided in the first portion to separate the first portion into a light-receiving cavity and a slot, and is provided with a plurality of light-passing holes via which the light-receiving cavity is in communication with the slot; an optical fiber adapter disposed in the housing assembly and in communication with the light-receiving cavity; a light-emitting assembly arranged in the light emitting cavity and electrically connected to the circuit board, wherein heat generated by the light-emitting assembly is conducted to a surface of the housing assembly via the partition wall; and a light-receiving assembly.
-
公开(公告)号：US12235497B2
公开(公告)日：2025-02-25
申请号：US18619079
申请日：2024-03-27
Inventor： Honghao Zhang , Benzheng Dong , Yifan Xie , Kai Liu , Qinhao Fu , Dan Li , Tengfei Wang
Abstract: The present disclosure discloses an optical module including a circuit board; a housing assembly including a light-receiving portion and a light-emitting cavity separated via a separation board and stacked one above the other, one side of the housing assembly adjacent to the circuit board being provided with a first notch through which one end of the circuit board is inserted into the housing assembly; a light-receiving assembly disposed in the light-receiving portion and electrically connected to an upper surface of the circuit board; and a light-emitting assembly disposed in the light-emitting cavity and electrically connected to a lower surface of the circuit board; a concave region is formed in the light-emitting cavity, and a laser assembly of the light-emitting assembly is arranged therein to lift the laser assembly to reduce height difference between wire bonding surface of the laser assembly and lower surface of the circuit board.
-
公开(公告)号：US12132519B2
公开(公告)日：2024-10-29
申请号：US18087003
申请日：2022-12-22
Inventor： Dan Li , Yifan Xie , Mengbo Fu , Qinhao Fu , Tengfei Wang , Feng Cui , Chuanbin Li , Zhanpeng Zhang
Abstract: An optical module includes a base, a first cover, a circuit board, a light emitting assembly and a light receiving assembly. The light emitting assembly includes a plurality of light-emitting chips and an optical multiplexer. The plurality of light-emitting chips are disposed on the first bottom plate. The optical multiplexer is disposed on the first cover and is located in a laser exit direction of the plurality of light-emitting chips. The light receiving assembly includes an optical demultiplexer and a plurality of light-receiving chips. The optical demultiplexer is disposed on the first cover. The plurality of light-receiving chips are disposed on the circuit board and are located in a laser exit direction of the optical demultiplexer.
-
公开(公告)号：US12013581B2
公开(公告)日：2024-06-18
申请号：US17490035
申请日：2021-09-30
CPC classification number: G02B6/4206 , G02B6/428
Abstract: An optical module includes a shell, a circuit board, a light-receiving device and an optical fiber ribbon. The circuit board is located in the shell. The light-receiving device is disposed on the circuit board and is electrically connected to the circuit board. An end of the optical fiber ribbon is connected to the light-receiving device. The light-receiving device includes a light-receiving chip and a focusing lens. The light-receiving chip is disposed on a surface of the circuit board and has a photosensitive surface. The focusing lens is disposed opposite to the photosensitive surface of the light-receiving chip, and is configured to converge light transmitted by the optical fiber ribbon to the photosensitive surface of the light-receiving chip.
-
-
-
-
-
Search Results
6
records
(took 0.017 seconds)
