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公开(公告)号:US20200060650A1
公开(公告)日:2020-02-27
申请号:US16361885
申请日:2019-03-22
Applicant: Hitachi, Ltd.
Inventor: Hidetsugu KATSURA , Yoshihiro TAHARA , Kazuhiro KOBAYASHI
Abstract: A backing includes a plurality of backing plates that are laminated. Each backing plate includes a lead row and a backing material. Each lead includes a lead wire and an insulating coating. The insulating coating is integrated with the backing material, and an adhesive layer between them does not exist. Short-circuit between the leads may be prevented or reduced by the insulating coating. The backing plate is manufactured by a screen printing method.
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公开(公告)号:US20200170625A1
公开(公告)日:2020-06-04
申请号:US16628252
申请日:2018-06-08
Applicant: Hitachi, Ltd.
Inventor: Kazuya MOTOKI , Toru WATANABE , Gen SHIINA , Kazuhiro KOBAYASHI
IPC: A61B8/00
Abstract: In order to estimate a temperature of a transmission-reception wavefront of a probe head, a first computing unit and a second computing unit are provided. The first computing unit estimates a temperature TA of the transmission-reception wavefront according to a basic function based on an internal temperature T1, an ambient temperature T2, power consumption Ptotal (=Pic+Ptd), and any other parameter. The basic function is a linear function. The second computing unit estimates a temperature TB of the transmission-reception wavefront according to an auxiliary function based on a previously estimated temperature Tpre, an internal temperature difference ΔT1, and any other, parameter. A selection unit selects any of the temperatures TA and TB depending on situations.
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公开(公告)号:US20180040805A1
公开(公告)日:2018-02-08
申请号:US15551304
申请日:2016-01-18
Applicant: HITACHI, LTD.
Inventor: Kazuya MOTOKI , Kazuhiro KOBAYASHI , Toru WATANABE
IPC: H01L41/113 , H01L41/09 , H04R17/10 , G01S7/521
Abstract: A resonance layer (30) and an acoustic separation layer (34) are arranged adjacent to each other between a piezoelectric element (24) and a circuit board (16) provided with an electronic circuit for driving the piezoelectric element. The acoustic impedance of the resonance layer (30) is higher than that of the piezoelectric element (24), and the acoustic impedance of the acoustic separation layer (34) is lower than that of the circuit board (16). An ultrasonic wave is reflected at the interface between the resonance layer (30) and the acoustic separation layer (34) where the difference in acoustic impedance is large, and the ultrasonic wave propagating to the circuit-board (16) side is reduced.
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