Ultrasonic Probe and Method of Manufacturing Backing

    公开(公告)号:US20200060650A1

    公开(公告)日:2020-02-27

    申请号:US16361885

    申请日:2019-03-22

    Applicant: Hitachi, Ltd.

    Abstract: A backing includes a plurality of backing plates that are laminated. Each backing plate includes a lead row and a backing material. Each lead includes a lead wire and an insulating coating. The insulating coating is integrated with the backing material, and an adhesive layer between them does not exist. Short-circuit between the leads may be prevented or reduced by the insulating coating. The backing plate is manufactured by a screen printing method.

    ULTRASONIC DIAGNOSIS DEVICE AND TEMPERATURE MANAGEMENT METHOD

    公开(公告)号:US20200170625A1

    公开(公告)日:2020-06-04

    申请号:US16628252

    申请日:2018-06-08

    Applicant: Hitachi, Ltd.

    Abstract: In order to estimate a temperature of a transmission-reception wavefront of a probe head, a first computing unit and a second computing unit are provided. The first computing unit estimates a temperature TA of the transmission-reception wavefront according to a basic function based on an internal temperature T1, an ambient temperature T2, power consumption Ptotal (=Pic+Ptd), and any other parameter. The basic function is a linear function. The second computing unit estimates a temperature TB of the transmission-reception wavefront according to an auxiliary function based on a previously estimated temperature Tpre, an internal temperature difference ΔT1, and any other, parameter. A selection unit selects any of the temperatures TA and TB depending on situations.

    ULTRASONIC TRANSDUCER UNIT
    3.
    发明申请

    公开(公告)号:US20180040805A1

    公开(公告)日:2018-02-08

    申请号:US15551304

    申请日:2016-01-18

    Applicant: HITACHI, LTD.

    Abstract: A resonance layer (30) and an acoustic separation layer (34) are arranged adjacent to each other between a piezoelectric element (24) and a circuit board (16) provided with an electronic circuit for driving the piezoelectric element. The acoustic impedance of the resonance layer (30) is higher than that of the piezoelectric element (24), and the acoustic impedance of the acoustic separation layer (34) is lower than that of the circuit board (16). An ultrasonic wave is reflected at the interface between the resonance layer (30) and the acoustic separation layer (34) where the difference in acoustic impedance is large, and the ultrasonic wave propagating to the circuit-board (16) side is reduced.

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