公开(公告)号：US11452205B2

公开(公告)日：2022-09-20

申请号：US16781219

申请日：2020-02-04

Applicant: HITACHI, LTD.

Inventor： Yasuhiro Yoshimura ,  Akifumi Sako ,  Makoto Fukada ,  Masahiro Sato

IPC: H05K1/11 ,  G01N29/24 ,  G01N29/22 ,  H05K1/02

Abstract: Provided is an ultrasonic probe having ultrasonic elements and a printed-circuit board that establishes connection between the ultrasonic elements and external wiring, achieving strong connection between the ultrasonic elements and the printed-circuit board mechanically and electrically, and thereby improving performance in examination and diagnosis using the ultrasonic probe. The printed-circuit board with pads each having a via-hole to be bonded to electrode pads of a chip equipped with the ultrasonic elements, is provided with a reinforcement, in an area of the base material where the pad having the via-hole is not formed. The reinforcement is formed simultaneously with forming the pads and wiring on the printed-circuit board, having the same thickness as the pads. With the reinforcement, pressure is evenly applied to the printed-circuit board when the electrode pad is press-fitted into the pad having the via-hole, thereby preventing warping and deforming of the board.