-
公开(公告)号：US11642695B2
公开(公告)日：2023-05-09
申请号：US16768863
申请日：2018-08-23
Applicant: Hitachi, Ltd.
Inventor： Shuntaro Machida , Akifumi Sako , Yasuhiro Yoshimura
IPC: B06B1/02 , A61B8/00 , H01L23/498 , H01L23/00
CPC classification number: B06B1/0292 , A61B8/4444 , A61B8/54 , H01L23/4985 , H01L24/08 , B06B2201/76 , H01L2224/16227
Abstract: An ultrasonic probe includes a semiconductor chip in which an ultrasonic transducer is formed and an electrode pad electrically connected to an upper electrode or a lower electrode of the ultrasonic transducer is provided and a flexible substrate in which a bump electrically connected to the electrode pad is provided and the bump is disposed in a portion overlapping with a stepped portion of the semiconductor chip. Further, a height of a connection surface of the electrode pad of the semiconductor chip connected to the bump is lower than a height of a lower surface of the lower electrode.
-
公开(公告)号：US11478220B2
公开(公告)日：2022-10-25
申请号：US16359020
申请日：2019-03-20
Applicant: Hitachi, Ltd.
Inventor： Yasuhiro Yoshimura , Akifumi Sako , Masahiro Sato
Abstract: According to one embodiment, an ultrasonic probe includes: an oscillator; a base on which the oscillator is provided; a base conductive wire portion connected to the oscillator; a bump electrode portion supplying a signal to the oscillator via the base conductive wire portion; a pad portion engaging with the bump electrode portion; and an acoustic lens provided such that a force toward the bump electrode portion is applied to the pad portion.
-
公开(公告)号：US20210162462A1
公开(公告)日：2021-06-03
申请号：US16768863
申请日：2018-08-23
Applicant: Hitachi, Ltd.
Inventor： Shuntaro Machida , Akifumi Sako , Yasuhiro Yoshimura
IPC: B06B1/02 , H01L23/00 , H01L23/498 , A61B8/00
Abstract: An ultrasonic probe includes a semiconductor chip 101 in which a CMUT 102 is formed and an electrode pad 101a electrically connected to an upper electrode or a lower electrode of the CMUT 102 is provided and a flexible substrate 100 in which a bump 100b electrically connected to the electrode pad 101a is provided and the bump 100b is disposed in a portion overlapping with a stepped portion 101e of the semiconductor chip 101. Further, a height of a connection surface 101aa of the electrode pad 101a of the semiconductor chip 101 connected to the bump 100b is lower than a height of a lower surface of the lower electrode.
-
4.发明授权公开(公告)号：US09964635B2
公开(公告)日：2018-05-08
申请号：US14652039
申请日：2013-11-29
Applicant: HITACHI, LTD.
Inventor： Shuntaro Machida , Akifumi Sako , Taiichi Takezaki , Yasuhiro Yoshimura , Tatsuya Nagata , Naoaki Yamashita , Hiroki Tanaka
CPC classification number: G01S7/52079 , A61B8/4444 , A61B8/4494 , A61B8/54 , B06B1/0292 , B81C1/00301 , G01S15/8915
Abstract: Both controlling damage when assembling an ultrasonic probe using a chip formed with a capacitive ultrasonic transducer and securing operational reliability are achieved. In a semiconductor substrate on which the capacitive ultrasonic transducer (CMUT) is formed on a first primary surface, a protective film is formed on the surface of the ultrasonic transducer which is formed on the first primary surface of the semiconductor substrate which is then thinned by polishing a second primary surface opposite to the first primary surface of the semiconductor substrate, an ultrasonic transducer chip is cutout of the semiconductor substrate, a sound absorbing material is provided on the surface opposite to the surface formed with the ultrasonic transducer, and the protective film formed on the surface of the ultrasonic transducer is removed.
-
5.发明授权公开(公告)号：US11268937B2
公开(公告)日：2022-03-08
申请号：US16315676
申请日：2017-07-06
Applicant: HITACHI, LTD.
Inventor： Taiichi Takezaki , Shuntaro Machida , Daisuke Ryuzaki , Yasuhiro Yoshimura , Tatsuya Nagata , Naoaki Yamashita
IPC: H04R19/00 , G01N29/24 , G01N29/265 , A61B8/00 , B06B1/02
Abstract: A capacitive micromachined ultrasonic transducer 111A includes: a silicon substrate 101; an insulating film 102 formed over the silicon substrate 101; a lower electrode 103; insulating films 104 and 106; a cavity 105 constituted by a void formed in a portion of the insulating film 106; an upper electrode 107; insulating films 108 and 114; and a protective film 109. In addition, the insulating film 106, upper electrode 107, insulating film 108 and insulating film 114 above the cavity 105 configure a vibration film 110, and the protective film 109 above the vibration film 110 is divided into a plurality of isolated patterns regularly arranged with a gap 115 having a constant spacing formed therebetween.
-
Patent Agency Ranking
公开(公告)号：US11452205B2
公开(公告)日：2022-09-20
申请号：US16781219
申请日：2020-02-04
Applicant: HITACHI, LTD.
Inventor： Yasuhiro Yoshimura , Akifumi Sako , Makoto Fukada , Masahiro Sato
Abstract: Provided is an ultrasonic probe having ultrasonic elements and a printed-circuit board that establishes connection between the ultrasonic elements and external wiring, achieving strong connection between the ultrasonic elements and the printed-circuit board mechanically and electrically, and thereby improving performance in examination and diagnosis using the ultrasonic probe. The printed-circuit board with pads each having a via-hole to be bonded to electrode pads of a chip equipped with the ultrasonic elements, is provided with a reinforcement, in an area of the base material where the pad having the via-hole is not formed. The reinforcement is formed simultaneously with forming the pads and wiring on the printed-circuit board, having the same thickness as the pads. With the reinforcement, pressure is evenly applied to the printed-circuit board when the electrode pad is press-fitted into the pad having the via-hole, thereby preventing warping and deforming of the board.
-
公开(公告)号：US10603689B2
公开(公告)日：2020-03-31
申请号：US15513588
申请日：2015-04-21
Applicant: Hitachi, Ltd.
Inventor： Shuntaro Machida , Daisuke Ryuzaki , Tatsuya Nagata , Naoaki Yamashita , Yuko Hanaoka , Yasuhiro Yoshimura
Abstract: A structure that prevents a substrate from being warped is provided on a region or a location other than a membrane that determines the characteristics of a CMUT. In a CMUT in a structure in which a first conductive layer and a second conductive layer are provided sandwiching a cavity on a substrate, for example, as a warpage prevention structure, a warpage prevention layer that prevents the substrate from being warped is provided between the substrate and the first conductive film. When the insulating film disposed between the cavity and the first conductive film and the insulating film disposed between the cavity and the second conductive film are silicon oxide films, the warpage prevention layer includes a silicon nitride film.
-
公开(公告)号：US10258312B2
公开(公告)日：2019-04-16
申请号：US15200393
申请日：2016-07-01
Applicant: Hitachi, Ltd.
Inventor： Yasuhiro Yoshimura , Tatsuya Nagata , Akifumi Sako
Abstract: In order to obtain a high-resolution ultrasound diagnostic image while reducing the back side reflection of a ultrasound irradiated to the side opposite to the ultrasound transmission direction of an ultrasound transmission/reception device, disclosed is an ultrasound probe, wherein a substrate is provided thereon with a cavity, insulation layers having the cavity therebetween, and an upper layer electrode and a lower layer electrode having the cavity and the insulation layers therebetween, so as to form an ultrasound vibration element, the substrate is held by a backing with a low-modulus member therebetween, and a direct voltage and a alternating voltage are applied between the electrodes to vibrate the ultrasound vibration element, and wherein a mechanical impedance by the substrate and the low-modulus member has a substantially equal value as an acoustic impedance of the backing.
-
公开(公告)号：US09846145B2
公开(公告)日：2017-12-19
申请号：US14377265
申请日：2013-02-13
Applicant: Hitachi, Ltd.
Inventor： Yasuhiro Yoshimura , Tatsuya Nagata , Akifumi Sako
CPC classification number: G01N29/2406 , A61B8/14 , A61B8/4444 , A61B8/4494 , A61B8/461 , B06B1/0292 , G01N2291/028 , G01N2291/044 , G01N2291/101
Abstract: Provided are: an ultrasound probe with excellent characteristic stability; and ultrasound equipment that uses the ultrasound probe. The ultrasound probe has an ultrasonic transmitting and receiving element provided with a substrate, an insulating film formed on the substrate, a cavity formed between the substrate and the insulating film, and a pair of electrodes disposed parallel to the substrate so as to sandwich the cavity. The ultrasound probe is characterized in that the ultrasonic transmitting and receiving element has a beam part with a multilayer structure formed by laminating films made of materials different in stress, the beam part being disposed on the electrode distant from the substrate out of the pair of electrodes, and the beam part is formed by laminating a film that applies tensile stress and a film that applies compressive stress.
-
10.发明授权公开(公告)号：US10784231B2
公开(公告)日：2020-09-22
申请号：US16310828
申请日：2017-06-20
Applicant: HITACHI, LTD.
Inventor： Yasuhiro Yoshimura , Akifumi Sako , Naoaki Yamashita , Tatsuya Nagata
IPC: H01L23/34 , H01L25/065 , B06B1/02 , H01L23/00
Abstract: The present invention addresses the problem of enlarging a sensing area in an ultrasonic probe so as to achieve a higher definition. This ultrasonic diagnostic equipment is provided with an ultrasonic probe that comprises: a CMUT chip (2a) that has drive electrodes (3e)-(3j), etc., arranged in a grid-like configuration on a rectangular CMUT element section (21); and a CMUT chip (2b) that has drive electrodes (3p)-(3u), etc., arranged in a grid-like configuration on the rectangular CMUT element section (21), that is adjacent to the CMUT chip (2a), and in which the drive electrodes (3e)-(3j) of the adjacent CMUT chip (2a) are electrically connected to the respective drive electrodes (3p)-(3u) via bonding wires (4f)-(4i), etc.
-
-
-
-
-
-
-
-
-
Search Results
10
records
(took 0.015 seconds)
