-
公开(公告)号：US20210351157A1
公开(公告)日：2021-11-11
申请号：US16757798
申请日：2018-10-23
发明人： Motohiro NEGISHI , Hideo NAKAKO , Yuki KAWANA , Dai ISHIKAWA , Chie SUGAMA , Yoshinori EJIRI
摘要： This member connection method includes a printing step. In the printing step, a coating film-formed region in which the coating film is formed, and a coating film non-formed region in which the coating film is not formed are formed in the print pattern, and the coating film-formed region is divided into a plurality of concentric regions and a plurality of radial regions by means of a plurality of line-shaped regions provided so as to connect various points, which are separated apart from one another in the marginal part of the connection region.
-
2.发明申请公开(公告)号：US20200176411A1
公开(公告)日：2020-06-04
申请号：US16096807
申请日：2017-04-20
发明人： Yuki KAWANA , Hideo NAKAKO , Dai ISHIKAWA , Chie SUGAMA , Kazuhiko KURAFUCHI , Yoshinori EJIRI
摘要： Provided is a copper paste for joining including copper particles, second particles including a metal element other than copper, and a dispersion medium, in which the copper particles include submicro copper particles having a volume-average particle diameter of 0.12 μm or more and 0.8 μm or less and micro copper particles having a volume-average particle diameter of 2 μm or more and 50 μm or less, a sum of a content of the submicro copper particles and a content of the micro copper particles is 80% by mass or more of a sum of masses of the copper particles and the second particles, the content of the submicro copper particles is 30% by mass or more and 90% by mass or less of a sum of a mass of the submicro copper particles and a mass of the micro copper particles, and a content of the second particles is 0.01% by mass or more and 10% by mass or less of the sum of the masses of the copper particles and the second particles.
-
公开(公告)号：US20180342478A1
公开(公告)日：2018-11-29
申请号：US15757852
申请日：2016-09-07
发明人： Hideo NAKAKO , Kazuhiko KURAFUCHI , Yoshinori EJIRI , Dai ISHIKAWA , Chie SUGAMA , Yuki KAWANA
IPC分类号： H01L23/00 , B22F7/08 , B22F1/00 , H01L23/367
摘要： Provided is a joined body including: a first member; a second member; and a sintered metal layer that joins the first member and the second member. The sintered metal layer includes a structure that is derived from flake-shaped copper particles which are oriented in approximately parallel to an interface between the first member or the second member, and the sintered metal layer, and the amount of copper contained in the sintered metal layer is 65% by volume or greater on the basis of a volume of the sintered metal layer.
-
公开(公告)号：US20200295248A1
公开(公告)日：2020-09-17
申请号：US16758166
申请日：2018-10-24
发明人： Motohiro NEGISHI , Yuki KAWANA , Dai ISHIKAWA , Chie SUGAMA , Hideo NAKAKO , Yoshinori EJIRI
摘要： A method for manufacturing a thermoelectric conversion module of the present invention is a method for manufacturing a thermoelectric conversion module including a thermoelectric semiconductor part in which a plurality of p-type semiconductors and a plurality of n-type semiconductors are alternately arranged, and a high temperature side electrode bound to a binding surface of the p-type semiconductor and the n-type semiconductor on a high temperature heat source side and a low temperature side electrode bound to a binding surface of the p-type semiconductor and the n-type semiconductor on a low temperature heat source side, which electrically connect the p-type semiconductor and the n-type semiconductor adjacent to each other in series, and includes a binding step of binding at least one of the high temperature side electrode and the low temperature side electrode, and the p-type semiconductor and the n-type semiconductor together, by sintering a binding layer containing metal particles, which is provided between the electrode and the semiconductor.
-
公开(公告)号：US20190355690A1
公开(公告)日：2019-11-21
申请号：US16476969
申请日：2017-01-11
发明人： Hideo NAKAKO , Kazuhiko KURAFUCHI , Yoshinori EJIRI , Dai ISHIKAWA , Chie SUGAMA , Yuki KAWANA
摘要： A copper paste for pressureless bonding is a copper paste for pressureless bonding, containing: metal particles; and a dispersion medium, in which the metal particles include sub-micro copper particles having a volume average particle diameter of greater than or equal to 0.01 μm and less than or equal to 0.8 μm, and micro copper particles having a volume average particle diameter of greater than or equal to 2.0 μm and less than or equal to 50 μm, and the dispersion medium contains a solvent having a boiling point of higher than or equal to 300° C., and a content of the solvent having a boiling point of higher than or equal to 300° C. is greater than or equal to 2 mass % on the basis of a total mass of the copper paste for pressureless bonding.
-
公开(公告)号：US20200344893A1
公开(公告)日：2020-10-29
申请号：US16762041
申请日：2018-11-08
发明人： Hideo NAKAKO , Yoshinori EJIRI , Dai ISHIKAWA , Chie SUGAMA , Yuki KAWANA , Motohiro NEGISHI , Yuichi YANAKA
摘要： Provided is a method for producing a joined body, the method including a first step of preparing a laminated body which includes a first member having a metal pillar provided on a surface thereof, a second member having an electrode pad provided on a surface thereof, and a joining material provided between the metal pillar and the electrode pad and containing metal particles and an organic compound, and a second step of heating the laminated body to sinter the joining material at a predetermined sintering temperature, in which the joining material satisfies the condition of the following Formula (I): (M1−M2)/M1×100≥1.0 (I) [in Formula (I), M1 represents a mass of the joining material when a temperature of the joining material reaches the sintering temperature in the second step, and M2 represents a non-volatile content in the joining material.]
-
公开(公告)号：US20200075528A1
公开(公告)日：2020-03-05
申请号：US16493507
申请日：2018-01-18
发明人： Yuki KAWANA , Hideo NAKAKO , Motohiro NEGISHI , Dai ISHIKAWA , Chie SUGAMA , Yoshinori EJIRI
摘要： Provided is a metal paste for joints, containing: metal particles; and linear or branched monovalent aliphatic alcohol having 1 to 20 carbon atoms, in which the metal particles include sub-micro copper particles having a volume average particle diameter of 0.12 μm to 0.8 μM.
-
8.发明申请公开(公告)号：US20180250751A1
公开(公告)日：2018-09-06
申请号：US15757790
申请日：2016-09-07
发明人： Yuki KAWANA , Kazuhiko KURAFUCHI , Yoshinori EJIRI , Hideo NAKAKO , Chie SUGAMA , Dai ISHIKAWA
CPC分类号： B22F7/08 , B22F1/00 , B22F1/0018 , B22F1/0055 , B22F2001/0033 , B22F2301/10 , B22F2304/056 , B22F2304/058 , B22F2304/10 , B22F2998/00 , B23K35/025 , C04B37/00 , H01B1/22 , H01L21/52 , H01L24/27 , H01L24/32 , H01L2224/33 , H01L2224/371 , H01L2224/40137 , H01L2224/40225 , H01L2224/40245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/01029 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
摘要： Provided is copper paste for joining including metal particles, and a dispersion medium. The metal particles include sub-micro copper particles having a volume-average particle size of 0.12 μm to 0.8 μm, and micro copper particles having a volume-average particle size of 2 μm to 50 μm, a sum of the amount of the sub-micro copper particles contained and the amount of the micro copper particles contained is 80% by mass or greater on the basis of a total mass of the metal particles, and the amount of the sub-micro copper particles contained is 30% by mass to 90% by mass on the basis of a sum of a mass of the sub-micro copper particles and a mass of the micro copper particles.
-
-
-
-
-
-
-
搜索结果
8 条记录 (耗时 0.018 秒)
