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公开(公告)号:US10316918B2
公开(公告)日:2019-06-11
申请号:US15161308
申请日:2016-05-23
Applicant: HITACHI CHEMICAL COMPANY, LTD.
Inventor: Mitsuo Unno , Masamichi MItsumoto , Kazuya Baba , Takashi Kikudome
IPC: F16D69/02
Abstract: Provided by the present invention are: a non-asbestos frictional material composition containing a binder, an organic filler, an inorganic filler, and a fiber substrate, wherein, in the non-asbestos frictional material composition, content of a copper is 5% or less by mass as a copper element, content of a metal fiber other than a copper fiber and a copper alloy fiber is 0.5% or less by mass, and a titanate salt is contained therein with antimony trisulfide or zinc powders, with content of the titanate salt being in the range of 10 to 35% by mass; and a frictional material and a friction member that use the said non-asbestos frictional material composition.
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公开(公告)号:US11649869B2
公开(公告)日:2023-05-16
申请号:US16491195
申请日:2017-03-06
Applicant: HITACHI CHEMICAL COMPANY, LTD.
Inventor: Kazuya Baba , Teruyuki Nagayoshi , Yuichi Fukuzawa
CPC classification number: F16D69/026 , F16D65/04 , F16D2200/0039 , F16D2200/0065
Abstract: There are provided a friction material composition containing no copper or having a reduced content of copper that can provide a friction material in which the stability of the friction coefficient after standing in a cold environment, the abrasion resistance, and the low rust fixation properties are excellent, and squeal (particularly low temperature squeal) is suppressed, and a friction material obtained by molding the friction material composition, and a friction member using the friction material. The friction material composition is specifically a friction material composition comprising a bonding material, an organic filler, an inorganic filler, and a fiber substrate, in which the friction material composition comprises no copper, or has a content of copper of less than 0.5% by mass in terms of a copper element even if comprising the copper, and comprises, as the organic filler, cashew particles to which a silicone resin adheres.
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公开(公告)号:US10570975B2
公开(公告)日:2020-02-25
申请号:US16072214
申请日:2016-01-27
Applicant: HITACHI CHEMICAL COMPANY, LTD.
Inventor: Kazuya Baba , Teruyuki Nagayoshi
Abstract: Provided is a friction material composition including: a binder; an organic filler; an inorganic filler; and a fiber substrate, in which a content of copper as an element is 0.5% by mass or less, the friction material composition contains at least one of phlogopite or biotite in a total of from 3% by mass to 9% by mass, and a graphite in an amount of from 2% by mass to 6% by mass, as the inorganic fillers, the at least one of phlogopite or biotite has an average particle size of from 340 μm to 1,500 μm, and the graphite has an average particle size of from 450 μm to 1,100 μm.
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公开(公告)号:US20180112730A1
公开(公告)日:2018-04-26
申请号:US15838870
申请日:2017-12-12
Applicant: HITACHI CHEMICAL COMPANY, LTD.
Inventor: Takashi Kikudome , Mitsuo Unno , Kazuya Baba
IPC: F16D65/092 , F16D69/02
CPC classification number: F16D65/092 , F16D69/026 , F16D2200/0065 , F16D2200/0069 , F16D2200/0073 , F16D2200/0086
Abstract: A non-asbestos frictional material composition is provided, which is capable of provide a frictional material with low environmental load and with excellent friction coefficient, anti-crack properties, and abrasion resistance compared with conventional ones. Furthermore, a frictional material and a friction member formed by using this non-asbestos frictional material composition are provided. The non-asbestos frictional material composition containing a binder, an organic filler, an inorganic filler, and a fiber base material, includes: copper in a content of 5 mass % or less as a copper element; a metal fiber other than a copper fiber and a copper alloy fiber in a content of 0.5 mass % or less; cashew dust in a content of 1.5-4.5 mass % as the organic filler; zirconium oxide with a particle size of 30 μm or less in a content of 30-45 mass % but not containing zirconium oxide with a particle size of more than 30 μm as the inorganic filler.
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