公开(公告)号：US20190305225A1

公开(公告)日：2019-10-03

申请号：US15759005

申请日：2016-09-07

申请人： HITACHI CHEMICAL COMPANY, LTD.

发明人： Yuki YOSHINARI ,  Kenichi ISHITSUKA ,  Tomotsugu SUGIOKA ,  Shigeaki FUNYUU ,  Shunsuke UEDA ,  Naoki ASANO ,  Hiroshi TAKAIRA ,  Iori FUKUSHIMA ,  Daisuke RYUZAKI

IPC分类号： H01L51/00 ,  C09D11/52 ,  C09D11/102 ,  C08G61/12 ,  G02F1/13357

摘要： An organic electronic material containing a charge transport polymer for which, in a molecular weight distribution chart measured by GPC, the area ratio accounted for by components having a molecular weight of less than 20,000 is not more than 40%, and the area ratio accounted for by components having a molecular weight of 500 or less is not more than 1%.

公开(公告)号：US20190040187A1

公开(公告)日：2019-02-07

申请号：US16072899

申请日：2016-11-24

申请人： HITACHI CHEMICAL COMPANY, LTD.

发明人： Akihiro SANO ,  Shunsuke UEDA ,  Shigeaki FUNYUU

IPC分类号： C08G61/12 ,  H01L51/50 ,  H01L51/52 ,  H01L51/00

摘要： Used is an organic light emitting device having an anode, a hole transport layer, a emission layer, and a cathode, in which: the hole transport layer is arranged between the anode and the emission layer; the hole transport layer includes an ion polymerization initiator and a curable resin; the curable resin has a hole carrier generated by being doped chemically by the ion polymerization initiator; and the hole transport layer shows ohmic conductivity. The present invention therefore makes it possible to increase the luminous efficiency of an organic light emitting device and improve a service life characteristic.

公开(公告)号：US20190023868A1

公开(公告)日：2019-01-24

申请号：US15743201

申请日：2016-03-08

申请人： HITACHI CHEMICAL COMPANY, LTD.

发明人： Shunsuke UEDA ,  Kanako ISHIHARA ,  Keiichi KASUGA ,  Ken ORIE ,  Kazuhito KOBAYASHI

IPC分类号： C08J11/24 ,  C08J11/16

摘要： A method of treating a thermosetting resin cured product, the method includes a treatment step of contacting an object to be treated, that contains a thermosetting resin cured product, with a treatment liquid containing an alkali metal hydroxide and an alcohol solvent, to decompose and dissolve the thermosetting resin cured product, in which moisture in the treatment liquid is removed during at least a part of a period of time from after preparation of the treatment liquid to completion of the treatment step.