公开(公告)号：US20190040187A1

公开(公告)日：2019-02-07

申请号：US16072899

申请日：2016-11-24

申请人： HITACHI CHEMICAL COMPANY, LTD.

发明人： Akihiro SANO ,  Shunsuke UEDA ,  Shigeaki FUNYUU

IPC分类号： C08G61/12 ,  H01L51/50 ,  H01L51/52 ,  H01L51/00

摘要： Used is an organic light emitting device having an anode, a hole transport layer, a emission layer, and a cathode, in which: the hole transport layer is arranged between the anode and the emission layer; the hole transport layer includes an ion polymerization initiator and a curable resin; the curable resin has a hole carrier generated by being doped chemically by the ion polymerization initiator; and the hole transport layer shows ohmic conductivity. The present invention therefore makes it possible to increase the luminous efficiency of an organic light emitting device and improve a service life characteristic.

公开(公告)号：US20180148622A1

公开(公告)日：2018-05-31

申请号：US15576533

申请日：2016-05-24

申请人： HITACHI CHEMICAL COMPANY, LTD.

发明人： Yoshitaka TAKEZAWA ,  Shihui SONG ,  Keiji FUKUSHIMA ,  Tomokazu TANASE ,  Tetsuji KATOH ,  Akihiro SANO ,  Hiroaki KOJIMA

IPC分类号： C09K5/14 ,  F28F21/06 ,  F28F21/08 ,  C08J5/18 ,  C08L63/00 ,  H01B3/40 ,  B32B15/092 ,  C08J5/24

CPC分类号： C09K5/14 ,  B32B15/08 ,  B32B15/092 ,  B32B2264/107 ,  B32B2307/302 ,  C08J5/18 ,  C08J5/24 ,  C08J2363/00 ,  C08J2461/14 ,  C08K3/22 ,  C08L63/00 ,  C08L101/00 ,  F28F21/065 ,  F28F21/089 ,  H01B3/40

摘要： A resin composition contains: a thermosetting resin; a thermally conductive filler; and mica; in which, when the thermally conductive filler is divided into a filler group (A) having a particle diameter of from 10 μm to 100 μm, a filler group (B) having a particle diameter of from 1.0 μm to smaller than 10 μm, and a filler group (C) having a particle diameter of from 0.1 μm to smaller than 1.0 μm, a ratio of the filler group (C) with regard to the thermally conductive filler, based on volume, is larger than a ratio of the filler group (B) with regard to the thermally conductive filler, based on volume.