公开(公告)号：US09914182B2

公开(公告)日：2018-03-13

申请号：US14857050

申请日：2015-09-17

Applicant: HONEYWELL INTERNATIONAL INC.

Inventor： Don Mittendorf ,  Christopher David Gatto ,  Leticia Lara ,  Megan Kemp ,  Andy Szuromi

IPC: B23K1/00 ,  B23K20/16 ,  B23K35/30 ,  B23K101/00

CPC classification number: B23K20/16 ,  B23K1/0018 ,  B23K20/002 ,  B23K20/026 ,  B23K20/233 ,  B23K35/00 ,  B23K35/3033 ,  B23K2101/001 ,  B23K2103/26

Abstract: A method for transient liquid phase bonding two metallic substrate segments together including the steps of forming a joined component by bringing together the two substrate segments along a bond line with a brazing alloy comprising a melting point depressant disposed between the two segments at the bond line and performing a first thermal treatment including heating the joined component at a brazing temperature of the brazing alloy for a first period of time. The method further includes performing a second thermal treatment including heating the joined component at an intermediate temperature that is above the brazing temperature but below a gamma prime solvus temperature of the substrate segments for a second period of time and performing a third thermal treatment including heating the joined component at a super-solvus temperature that is above the gamma prime solvus temperature of the two metallic substrate segments for a third period of time.

公开(公告)号：US20170080521A1

公开(公告)日：2017-03-23

申请号：US14857050

申请日：2015-09-17

Applicant: HONEYWELL INTERNATIONAL INC.

Inventor： Don Mittendorf ,  Christopher David Gatto ,  Leticia Lara ,  Megan Kemp ,  Andy Szuromi

IPC: B23K20/16 ,  B23K35/30

CPC classification number: B23K20/16 ,  B23K1/0018 ,  B23K20/002 ,  B23K20/026 ,  B23K20/233 ,  B23K35/00 ,  B23K35/3033 ,  B23K2101/001 ,  B23K2103/26

Abstract: A method for transient liquid phase bonding two metallic substrate segments together including the steps of forming a joined component by bringing together the two substrate segments along a bond line with a brazing alloy comprising a melting point depressant disposed between the two segments at the bond line and performing a first thermal treatment including heating the joined component at a brazing temperature of the brazing alloy for a first period of time. The method further includes performing a second thermal treatment including heating the joined component at an intermediate temperature that is above the brazing temperature but below a gamma prime solvus temperature of the substrate segments for a second period of time and performing a third thermal treatment including heating the joined component at a super-solvus temperature that is above the gamma prime solvus temperature of the two metallic substrate segments for a third period of time.