公开(公告)号：US12121987B1

公开(公告)日：2024-10-22

申请号：US18700484

申请日：2022-10-07

申请人： PINK GMBH THERMOSYSTEME

发明人： Christoph Oetzel

IPC分类号： B23K1/00 ,  B23K1/008 ,  B23K3/08 ,  B23K20/02 ,  B23K20/16 ,  B23K101/42

CPC分类号： B23K1/0016 ,  B23K1/008 ,  B23K3/087 ,  B23K20/026 ,  B23K20/16 ,  B23K2101/42

摘要： The present invention relates to a sintering device or diffusion soldering device for connecting components of at least one electronic assembly by means of pressure sintering, comprising an evacuatable process chamber in which an upper tool and a lower tool are arranged, between which the assembly is held and which are displaceable relative to one another in their distance apart to exert a press force, wherein the process chamber comprises a base body having on its upper side an access opening and a cover which is adjustable between a closed position in which the access opening is closed by the cover and an open position, wherein the upper tool is supported on the cover in the closed position of the cover at least during the exertion of the press force.

公开(公告)号：US20240123541A1

公开(公告)日：2024-04-18

申请号：US18263919

申请日：2021-12-20

申请人： SONY GROUP CORPORATION ,  TOHOKU UNIVERSITY

发明人： Shohei ABE ,  Yuichi TAKAHASHI ,  Takehito SHIMATSU ,  Miyuki UOMOTO

IPC分类号： B23K20/02 ,  B23K20/16 ,  B32B7/10 ,  B32B9/04 ,  B32B38/00

CPC分类号： B23K20/026 ,  B23K20/16 ,  B32B7/10 ,  B32B9/041 ,  B32B38/0036 ,  B23K2103/52 ,  B32B2250/05 ,  B32B2250/40 ,  B32B2307/40 ,  B32B2307/538

摘要： A structure according to an embodiment of the present disclosure include: a first base; a second base disposed to be opposed to the first base; and a bonding layer that is provided between the first base and the second base, and includes, in a layer, a layer including a first metal element and a second metal element, the first metal element having a free energy of oxide formation (ΔG) of −330 (kJ/mol of compounds) or more at room temperature and a self-diffusion coefficient (D) of 1×10−55 (m2/s) or more at room temperature, and the second metal element having a free energy of oxide formation (ΔG) at room temperature smaller than the free energy of oxide formation (ΔG) at the room temperature of the first metal element.

公开(公告)号：US11872392B2

公开(公告)日：2024-01-16

申请号：US17536360

申请日：2021-11-29

申请人： Medtronic, Inc.

发明人： Darren A. Janzig ,  Andrew J. Thom ,  Chris J. Paidosh ,  Brad C. Tischendorf ,  Gerald G. Lindner

IPC分类号： A61N1/05 ,  H01R13/187 ,  H01R24/58 ,  A61N1/375 ,  B23K26/21 ,  B23K20/02 ,  C23C14/10 ,  C23C14/18 ,  C23C14/34 ,  H01R43/02 ,  B23K101/38 ,  B23K103/00 ,  B23K103/16 ,  H01R107/00

CPC分类号： A61N1/05 ,  A61N1/3752 ,  B23K20/026 ,  B23K26/21 ,  C23C14/10 ,  C23C14/18 ,  C23C14/34 ,  H01R13/187 ,  H01R24/58 ,  H01R43/0221 ,  A61B2562/227 ,  B23K2101/38 ,  B23K2103/172 ,  B23K2103/52 ,  B23K2103/54 ,  H01R2107/00 ,  H01R2201/12 ,  Y10T156/10

摘要： A medical device lead connector includes electrically conducting contact rings spaced apart by an electrically insulating ring and in axial alignment. The electrically conducting contact ring and the insulating ring having an interface bond on an atomic level.

公开(公告)号：US11745288B2

公开(公告)日：2023-09-05

申请号：US17251407

申请日：2019-05-23

申请人： Endress+Hauser SE+Co. KG

发明人： Andreas Rossberg ,  Anh Tuan Tham ,  Elke Schmidt ,  Nils Ponath ,  Jonas Conradt ,  Yanli Wang ,  Thomas Uehlin

IPC分类号： B23K20/02 ,  B23K20/233 ,  C04B37/02 ,  G01L9/00 ,  G01L13/02 ,  G01L19/14 ,  B23K103/18 ,  B23K101/36 ,  B23K103/00 ,  B23K103/14

CPC分类号： B23K20/026 ,  B23K20/233 ,  C04B37/021 ,  G01L9/0075 ,  G01L13/025 ,  G01L19/147 ,  B23K2101/36 ,  B23K2103/14 ,  B23K2103/18 ,  B23K2103/52 ,  C04B2237/343 ,  C04B2237/403

摘要： A pressure measuring device includes a ceramic pressure sensor including a ceramic measuring membrane and a sensor mounting configured to secure the pressure sensor such that a membrane region of the measuring membrane surrounded by a membrane edge is contactable with a medium having a pressure to be measured. The sensor mounting includes a titanium or titanium alloy mounting element including an opening through which the membrane region is contactable with the medium. The membrane edge is connected directly with the mounting element by a diffusion weld produced by a diffusion welding method.

公开(公告)号：US11738305B2

公开(公告)日：2023-08-29

申请号：US17412581

申请日：2021-08-26

申请人： Element 1 Corp.

发明人： David J. Edlund ,  Robert Todd Studebaker

IPC分类号： B01D53/22 ,  B01D71/02 ,  C01B3/50 ,  B01D63/08 ,  B23K20/22 ,  B23K20/02 ,  B23K20/16 ,  B23K103/08

CPC分类号： B01D53/228 ,  B01D53/226 ,  B01D63/082 ,  B01D71/022 ,  B23K20/023 ,  B23K20/16 ,  B23K20/22 ,  C01B3/505 ,  B01D2053/221 ,  B01D2053/222 ,  B01D2256/16 ,  B01D2257/502 ,  B01D2257/504 ,  B01D2257/7022 ,  B01D2257/7025 ,  B01D2257/80 ,  B23K20/026 ,  B23K2103/08 ,  C01B2203/0233 ,  C01B2203/0405 ,  C01B2203/0445 ,  C01B2203/0827 ,  C01B2203/0883 ,  C01B2203/1223 ,  C01B2203/1288 ,  C01B2203/142 ,  C01B2203/1619

摘要： Hydrogen purification devices and their components are disclosed. In some embodiments, the devices may include at least one foil-microscreen assembly disposed between and secured to first and second end frames. The at least one foil-microscreen assembly may include at least one hydrogen-selective membrane and at least one microscreen structure including a non-porous planar sheet having a plurality of apertures forming a plurality of fluid passages. The planar sheet may include generally opposed planar surfaces configured to provide support to the permeate side. The plurality of fluid passages may extend between the opposed surfaces. The at least one hydrogen-selective membrane may be metallurgically bonded to the at least one microscreen structure.

公开(公告)号：US20180187564A1

公开(公告)日：2018-07-05

申请号：US15397840

申请日：2017-01-04

申请人： GENERAL ELECTRIC COMPANY

发明人： Yan CUI ,  Srikanth Chandrudu KOTTILINGAM ,  Brian Lee TOLLISON ,  Dechao LIN ,  Cem Murat EMINOGLU

IPC分类号： F01D9/04 ,  B23K1/00 ,  B23K1/20 ,  B23P6/00 ,  G01B11/03 ,  F01D5/30

CPC分类号： F01D9/042 ,  B23H9/12 ,  B23K1/0018 ,  B23K1/20 ,  B23K20/026 ,  B23K20/16 ,  B23K26/34 ,  B23K26/382 ,  B23K31/02 ,  B23K35/0238 ,  B23K35/0244 ,  B23K35/22 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/3046 ,  B23K35/322 ,  B23K35/325 ,  B23K2101/001 ,  B23K2103/26 ,  B23P6/002 ,  B33Y10/00 ,  B33Y80/00 ,  C23C2/04 ,  C23C2/26 ,  C23C2/28 ,  C23C2/34 ,  C23C4/02 ,  C23C4/06 ,  C23C4/12 ,  C23C4/18 ,  C23C14/16 ,  C23C16/06 ,  C23C26/00 ,  C25D3/02 ,  C25D7/00 ,  F01D5/005 ,  F01D5/3061 ,  F05D2230/22 ,  F05D2230/236 ,  F05D2230/237 ,  F05D2230/238 ,  F05D2230/80 ,  F05D2250/292 ,  F05D2300/175 ,  G01B11/03

摘要： A method for treating a component and a treated component are provided. The method includes the steps of machining a tapered slot in the component. The tapered slot is measured to determine dimensions. An insert is formed to have a corresponding geometry to the tapered slot with a braze gap between an outer surface of the insert and an inner surface of the tapered slot. A layer of a braze material is deposited on the outer surface of the insert, where a thickness of the layer corresponds to the braze gap. The layer of the braze material on the outer surface of the insert is sintered to fabricate a diffusion layer. The insert is positioned into the tapered slot. The diffusion layer is brazed to join the insert to the taper slot. The treated component includes a surface having a tapered slot, an insert, and a braze joint.

公开(公告)号：US20180036798A1

公开(公告)日：2018-02-08

申请号：US15786964

申请日：2017-10-18

申请人： Murata Manufacturing Co., Ltd.

发明人： Seitaro Washizuka

IPC分类号： B22F1/00 ,  B23K35/02 ,  B23K20/00 ,  B23K1/00

CPC分类号： B22F1/0014 ,  B22F1/0003 ,  B22F1/0059 ,  B22F7/064 ,  B22F2998/10 ,  B22F2999/00 ,  B23K1/0002 ,  B23K1/0016 ,  B23K1/19 ,  B23K1/20 ,  B23K20/00 ,  B23K20/026 ,  B23K20/16 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/302 ,  B23K2101/42 ,  C22C9/00 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  C22C13/02 ,  H05K3/34 ,  H05K3/3457 ,  H05K2203/0425 ,  B22F3/12 ,  B22F2003/248 ,  C22C1/0491

摘要： A bonding member that includes a resin body defining an airtight interior, and a bonding material enclosed in the interior of the resin body. The bonding material is a mixed powder that includes a plurality of particles of a first metal powder and a plurality of particles of a second metal powder. The second metal powder reacts with the first metal powder when melted to thereby produce an intermetallic compound. The resin body has a melting point higher than a softening point of the mixed powder.

公开(公告)号：US09850950B2

公开(公告)日：2017-12-26

申请号：US14782796

申请日：2014-04-07

申请人： AKTIEBOLAGET SKF

发明人： Ingemar Strandell

IPC分类号： F16C33/64 ,  F16C33/62 ,  B22F7/08 ,  F16C33/30 ,  B23K20/02 ,  B23K20/227 ,  B22F3/15 ,  B23K103/04 ,  B23K103/18

CPC分类号： F16C33/62 ,  B22F3/15 ,  B22F7/08 ,  B22F2999/00 ,  B23K20/026 ,  B23K20/227 ,  B23K2103/04 ,  B23K2103/05 ,  B23K2103/18 ,  F16C33/30 ,  F16C33/64 ,  B22F2207/01

摘要： A bearing component part, a bearing component and a process for manufacturing the bearing component. The bearing component part comprises at least one circumferential peripheral surface, wherein the circumferential peripheral surface presents at least one groove extending along at least a part of the circumference of the peripheral surface, wherein the groove is arranged to receive a second material, the peripheral surface further presenting a first and a second portion located on opposite sides of the at least one groove along the circumference of the peripheral surface, wherein the bearing component part comprises a weldable metallic material.

公开(公告)号：US20170207191A1

公开(公告)日：2017-07-20

申请号：US14996907

申请日：2016-01-15

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： XIN-HUA HUANG ,  PING-YIN LIU ,  CHIN-WEI LIANG ,  YEONG-JYH LIN ,  KUAN-LIANG LIU ,  CHIA-SHIUNG TSAI

IPC分类号： H01L23/00 ,  B23K1/00 ,  B23K1/20 ,  H01L21/67

CPC分类号： H01L24/75 ,  B23K20/002 ,  B23K20/026 ,  B23K20/16 ,  B23K20/233 ,  B23K20/24 ,  B23K20/26 ,  B23K2101/34 ,  B23K2101/40 ,  B23K2103/12 ,  H01L21/67092 ,  H01L24/80 ,  H01L2224/7525 ,  H01L2224/7598 ,  H01L2224/8001 ,  H01L2224/80895 ,  H01L2224/80948 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2224/80001

摘要： A bonding system includes: a storage apparatus, including a chamber, wherein the chamber is configured to accommodate a first semiconductor wafer and a second semiconductor wafer transferred from a load port, and a gas is provided to the chamber to purge oxygen out of the chamber; a surface treatment station, configured to perform a surface activation upon the first and second semiconductor wafers transferred from the storage apparatus; a cleaning station, configured to remove undesirable substances from surfaces of the first and second semiconductor wafers transferred from the surface treatment station; and a pre-bonding station, configured to bond the first and second semiconductor wafers together to produce a bonded first and second semiconductor wafer pair, wherein the first and second semiconductor wafers are transferred from the cleaning station. An associated apparatus and method are also disclosed.

公开(公告)号：US09682445B1

公开(公告)日：2017-06-20

申请号：US15043231

申请日：2016-02-12

申请人： Kathleen Chou ,  Kevin T. Slattery

发明人： Kathleen Chou ,  Kevin T. Slattery

IPC分类号： B23K31/02 ,  B23K20/02 ,  B23K35/34 ,  B23K35/02

CPC分类号： B23K35/025 ,  B23K20/02 ,  B23K20/026 ,  B23K20/10 ,  B23K20/16 ,  B23K35/001 ,  B23K35/34

摘要： A method includes disposing ZrH2 nanoparticles on a first metallic material. The method includes performing a diffusion bonding operation to bond the first metallic material to a second metallic material. At least one of the first metallic material or the second metallic material includes a surface oxide layer. During the diffusion bonding operation, the ZrH2 nanoparticles chemically react with the surface oxide layer.