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公开(公告)号：US20160100494A1
公开(公告)日：2016-04-07
申请号：US14504948
申请日：2014-10-02
Applicant: Honeywell International Inc.
Inventor： Peter Novysedlak , Ondrej Hajek , Martin Konecny , Milan Vasicek
CPC classification number: H05K5/0239 , B81B7/0032 , G01D3/028 , G01D11/245 , G01P1/023 , H05K1/0212 , H05K5/0013 , H05K5/0213 , H05K2201/06
Abstract: An enclosure for thermally stabilizing a temperature sensitive component on a circuit board is provided. The enclosure comprises a first cover section configured to be mounted over a portion of a first side of the circuit board where at least one temperature sensitive component is mounted. The first cover section includes a first lid, and at least one sidewall that extends from a perimeter of the first lid. The enclosure also comprises a second cover section configured to be mounted over a portion of a second side of the circuit board opposite from the first cover section. The second cover section includes a second lid, and at least one sidewall that extends from a perimeter of the second lid. The first and second cover sections are configured to releasably connect with the circuit board.
Abstract translation: 提供了用于热稳定电路板上的温度敏感元件的外壳。 外壳包括构造成安装在电路板的第一侧的至少一个温度敏感元件的一部分上的第一盖部分。 第一盖部分包括第一盖和从第一盖的周边延伸的至少一个侧壁。 外壳还包括第二盖部分，其构造成安装在与第一盖部分相对的电路板的第二侧的一部分上。 第二盖部分包括第二盖，以及从第二盖的周边延伸的至少一个侧壁。 第一和第二盖部被构造成可释放地与电路板连接。
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公开(公告)号：US09560779B2
公开(公告)日：2017-01-31
申请号：US14504948
申请日：2014-10-02
Applicant: Honeywell International Inc.
Inventor： Peter Novysedlak , Ondrej Hajek , Martin Konecny , Milan Vasicek
CPC classification number: H05K5/0239 , B81B7/0032 , G01D3/028 , G01D11/245 , G01P1/023 , H05K1/0212 , H05K5/0013 , H05K5/0213 , H05K2201/06
Abstract: An enclosure for thermally stabilizing a temperature sensitive component on a circuit board is provided. The enclosure comprises a first cover section configured to be mounted over a portion of a first side of the circuit board where at least one temperature sensitive component is mounted. The first cover section includes a first lid, and at least one sidewall that extends from a perimeter of the first lid. The enclosure also comprises a second cover section configured to be mounted over a portion of a second side of the circuit board opposite from the first cover section. The second cover section includes a second lid, and at least one sidewall that extends from a perimeter of the second lid. The first and second cover sections are configured to releasably connect with the circuit board.
Abstract translation: 提供了用于热稳定电路板上的温度敏感元件的外壳。 外壳包括构造成安装在电路板的第一侧的至少一个温度敏感元件的一部分上的第一盖部分。 第一盖部分包括第一盖和从第一盖的周边延伸的至少一个侧壁。 外壳还包括第二盖部分，其构造成安装在与第一盖部分相对的电路板的第二侧的一部分上。 第二盖部分包括第二盖，以及从第二盖的周边延伸的至少一个侧壁。 第一和第二盖部被构造成可释放地与电路板连接。
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公开(公告)号：US20240262492A1
公开(公告)日：2024-08-08
申请号：US18453088
申请日：2023-08-21
Applicant: HONEYWELL INTERNATIONAL INC.
Inventor： Petr Hanus , Ondrej Hajek , Ondrej Mandel , Darrell W. Horner
IPC: B64C13/50
CPC classification number: B64C13/503
Abstract: A system configuration significantly reduces the number of interconnections needed between an electromechanical actuator (EMA) and an EMA controller (EMAC) while maintaining redundancy and other safety aspects needed by the target application. This allows simplification of communication interfaces between multiple sensors in the EMA and EMAC and unification of the interface to multiple sensors inside the EMAC, leading to cost and weight reduction that can be significant for many aerospace products and applications, including unmanned vehicle (e.g., UAM/UAV) applications.
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