公开(公告)号：US20180112019A1

公开(公告)日：2018-04-26

申请号：US15585766

申请日：2017-05-03

Applicant: HONEYWELL INTERNATIONAL INC.

Inventor： Ya Qun Lin ,  Wanchao Jiang ,  Gang Xu ,  Linlin Duan ,  Siyuan Zhang ,  Zhe Ding

IPC: C08F214/18 ,  C09D127/12

CPC classification number: C08F214/188 ,  C08F214/18 ,  C08F214/186 ,  C09D127/12 ,  H01L33/44 ,  H01L33/56 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2933/0025

Abstract: Disclosed are LEDs and LED packages, and methods of making them, having improved resistance to infiltration by chemical entities comprising providing a coating on at least a portion of the LED chip or an LED chip package formed by co-polymerization of: (a) one or more hydrofluoroolefin monomer(s) selected from the group consisting of tetrafluoroethylene, hydrofluoroethylenes, hydrofluoropropenes, hydrofluorobutenes, hydrofluoropentenes and combinations of these; (b) optionally one or more chlorofluoroethylene monomers; (c) optionally one or more vinyl ester monomer(s); and (d) optionally one or more vinyl ether monomer(s), wherein at least a portion of said vinyl ether monomer is preferably a hydroxyl group-containing vinyl ether monomer and preferably at least one of (b) and (d) is present.