MASK BLANK, PHASE SHIFT MASK, METHOD OF MANUFACTURING PHASE SHIFT MASK, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

    公开(公告)号:US20230194973A1

    公开(公告)日:2023-06-22

    申请号:US17926962

    申请日:2021-06-15

    CPC classification number: G03F1/32

    Abstract: Provided is a mask blank .
    A transmittance adjusting film is provided on a phase shift film; the phase shift film generates a phase difference of 150 degrees or more and 210 degrees or less between an ArF excimer laser exposure light transmitted through the phase shift film and the exposure light transmitted through the air for a same distance as a thickness of the phase shift film; and a refractive index nu with respect to a wavelength of the exposure light, an extinction coefficient ku with respect to the wavelength of the exposure light, and a thickness du[nm] of the transmittance adjusting film satisfy both equations (1) and (2) given below.





    d
    U


    -17
    .63
    ×

    n
    U



    3

    +142
    .0
    ×

    n
    U



    2

    -364
    .9
    ×

    n
    U

    +315
    .8









    d
    U


    -2
    .805
    ×

    k
    U



    3

    +19
    .48
    ×

    k
    U



    2

    -43
    .58
    ×

    k
    U

    +38
    .11

    MASK BLANK AND PHASE SHIFT MASK
    3.
    发明公开

    公开(公告)号:US20240361683A1

    公开(公告)日:2024-10-31

    申请号:US18560659

    申请日:2022-03-31

    CPC classification number: G03F1/32

    Abstract: Provided is a mask blank comprising a phase shift film A mask blank comprises a phase shift film on a transparent substrate. The phase shift film is made of a material comprising a transition metal, silicon, and nitrogen. A ratio of the total content of nitrogen and oxygen to the content of the transition metal is 12 or more and 19 or less in an internal region, wherein the internal region excludes a neighboring region of the phase shift film at an interface with the transparent substrate and a surface layer region of the phase shift film which is located opposite the transparent substrate.

    MASK BLANK, TRANSFER MASK, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

    公开(公告)号:US20230097280A1

    公开(公告)日:2023-03-30

    申请号:US17801377

    申请日:2021-03-08

    Abstract: An object is to provide a mask blank
    A mask blank having a substrate and a thin film, the substrate includes two main surfaces and a side surface with a chamfered surface provided between the two main surfaces and the side surface, one main surface of the two main surfaces includes an inner region including a center of the main surface and an outer peripheral region outside of the inner region, the thin film is provided on the inner region of the main surface, the surface reflectance Rs of the outer peripheral region with respect to light of 400 nm to 700 nm wavelength is 10% or less, and provided that Rf is the surface reflectance with respect to light of 400 nm to 700 nm wavelength in one section among sections of the thin film in the range of 9 nm to 10 nm film thickness, the contrast ratio (Rf/Rs) is 3.0 or more.

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