公开(公告)号：US20140301050A1

公开(公告)日：2014-10-09

申请号：US14209419

申请日：2014-03-13

Applicant: HOYA CORPORATION

Inventor： Takashi FUSHIE ,  Kunihiko UENO ,  Hajime KIKUCHI

IPC: H05K1/03 ,  H01L21/48 ,  H05K1/11 ,  H01L23/15

CPC classification number: H01L23/15 ,  G03F7/00 ,  H01L21/4871 ,  H01L21/561 ,  H01L21/568 ,  H01L23/49833 ,  H01L2924/0002 ,  Y10T428/24942 ,  H01L2924/00

Abstract: A substrate assembly including a photosensitive etching glass substrate; and a first substrate and a second substrate for interposing both main surfaces of the photosensitive etching glass substrate between them. One of the main surfaces of the photosensitive etching glass substrate is thermally bonded to the first substrate, and the other main surface of the photosensitive etching glass substrate is bonded to the second substrate. When a thermal expansion coefficient of the photosensitive etching glass substrate is defined as C0, and a thermal expansion coefficient of the first substrate is defined as C1, and a thermal expansion coefficient of the second substrate is defined as C2, C1/C2 satisfies a relation of 0.7 or more and 1.3 or less, and at least one of a relation of C0/C1 satisfying less than 0.7 or larger than 1.3, and a relation of C0/C2 satisfying less than 0.7 or larger than 1.3 is satisfied.

Abstract translation: 一种基板组件，包括光敏蚀刻玻璃基板; 以及用于将感光蚀刻玻璃基板的两个主表面插入它们之间的第一基板和第二基板。 感光蚀刻用玻璃基板的主表面之一与第一基板热粘接，感光蚀刻用玻璃基板的另一主面与第二基板接合。 当感光蚀刻玻璃基板的热膨胀系数定义为C0，将第一基板的热膨胀系数定义为C1，将第二基板的热膨胀系数定义为C2时，C1 / C2满足关系 为0.7以上且1.3以下，并且满足小于0.7或大于1.3的C 0 / C的关系和满足小于0.7或大于1.3的C 0 / C 2的关系中的至少一个。