公开(公告)号：US20140301050A1

公开(公告)日：2014-10-09

申请号：US14209419

申请日：2014-03-13

Applicant: HOYA CORPORATION

Inventor： Takashi FUSHIE ,  Kunihiko UENO ,  Hajime KIKUCHI

IPC: H05K1/03 ,  H01L21/48 ,  H05K1/11 ,  H01L23/15

CPC classification number: H01L23/15 ,  G03F7/00 ,  H01L21/4871 ,  H01L21/561 ,  H01L21/568 ,  H01L23/49833 ,  H01L2924/0002 ,  Y10T428/24942 ,  H01L2924/00

Abstract: A substrate assembly including a photosensitive etching glass substrate; and a first substrate and a second substrate for interposing both main surfaces of the photosensitive etching glass substrate between them. One of the main surfaces of the photosensitive etching glass substrate is thermally bonded to the first substrate, and the other main surface of the photosensitive etching glass substrate is bonded to the second substrate. When a thermal expansion coefficient of the photosensitive etching glass substrate is defined as C0, and a thermal expansion coefficient of the first substrate is defined as C1, and a thermal expansion coefficient of the second substrate is defined as C2, C1/C2 satisfies a relation of 0.7 or more and 1.3 or less, and at least one of a relation of C0/C1 satisfying less than 0.7 or larger than 1.3, and a relation of C0/C2 satisfying less than 0.7 or larger than 1.3 is satisfied.

Abstract translation: 一种基板组件，包括光敏蚀刻玻璃基板; 以及用于将感光蚀刻玻璃基板的两个主表面插入它们之间的第一基板和第二基板。 感光蚀刻用玻璃基板的主表面之一与第一基板热粘接，感光蚀刻用玻璃基板的另一主面与第二基板接合。 当感光蚀刻玻璃基板的热膨胀系数定义为C0，将第一基板的热膨胀系数定义为C1，将第二基板的热膨胀系数定义为C2时，C1 / C2满足关系 为0.7以上且1.3以下，并且满足小于0.7或大于1.3的C 0 / C的关系和满足小于0.7或大于1.3的C 0 / C 2的关系中的至少一个。

公开(公告)号：US20160152505A1

公开(公告)日：2016-06-02

申请号：US14906916

申请日：2014-08-04

Applicant: HOYA CORPORATION

Inventor： Takashi FUSHIE

IPC: C03B32/02 ,  C03B23/00

CPC classification number: C03B32/02 ,  C03B11/08 ,  C03B23/0013 ,  C03B29/02 ,  C03B32/00 ,  C03C15/00 ,  C03C23/002

Abstract: There is provided a method of manufacturing a photosensitive glass molding, including: softening a solid-state photosensitive glass material by heating; and molding the softened photosensitive glass material to obtain a photosensitive glass molding, wherein in the heating, a crystal precipitated on the photosensitive glass material is melted by heating.

Abstract translation: 提供了一种制造感光玻璃模制品的方法，包括：通过加热软化固态感光玻璃材料; 并且对软化的感光性玻璃材料进行成型以获得感光性玻璃成型体，其中在加热时，通过加热使在感光性玻璃材料上析出的结晶熔融。

公开(公告)号：US20150380224A1

公开(公告)日：2015-12-31

申请号：US14769003

申请日：2014-02-24

Applicant: HOYA CORPORATION

Inventor： Takashi FUSHIE

IPC: H01J43/08 ,  H01J9/12 ,  H01J47/02

CPC classification number: H01J43/08 ,  G01T1/28 ,  G01T1/2935 ,  H01J9/125 ,  H01J47/026 ,  H01J47/06

Abstract: An electronic amplifying substrate, including: a glass base material having an insulating property; conductive layers formed on both main surfaces of the glass base material; and a plurality of through holes formed on a lamination body of the glass base material and the conductive layer, wherein an electric field is formed in the through hole by a potential difference between both conductive layers during application of a voltage to a surface of the conductive layer so that an electron avalanche amplification occurs in the through hole, and an insulation part is formed on at least one main surface of the glass base material, with one of the end portions of the insulation part formed to surround an opening part of the through hole of the glass base material, and the other end portion formed in contact with the end portions of the conductive layers.

Abstract translation: 一种电子放大基板，包括：具有绝缘性的玻璃基材; 形成在玻璃基材的两个主表面上的导电层; 以及多个通孔，其形成在所述玻璃基材和所述导电层的层叠体上，其中，在对所述导电层的表面施加电压期间，通过所述两个导电层之间的电位差在所述通孔中形成电场 使得在通孔中发生电子雪崩放大，并且绝缘部分形成在玻璃基材的至少一个主表面上，绝缘部分的一个端部形成为围绕通孔的开口部分 玻璃基材的孔，另一端部形成为与导电层的端部接触。

公开(公告)号：US20160194240A1

公开(公告)日：2016-07-07

申请号：US14911456

申请日：2014-08-13

Applicant: HOYA CORPORATION

Inventor： Takashi FUSHIE

IPC: C03C4/04 ,  G03F7/38 ,  G03F7/36 ,  G03F7/20

CPC classification number: C03C4/04 ,  C03B32/00 ,  C03C3/095 ,  C03C15/00 ,  C03C23/0025 ,  G03F7/2051 ,  G03F7/36 ,  G03F7/38

Abstract: A method of manufacturing a photosensitive glass substrate, including: directly irradiating a plate-like base material composed of a photosensitive glass with an energy beam to form a latent image; crystallizing the latent image by a first heat treatment to obtain a crystallized portion; and dissolving and removing the crystallized portion and applying fine processing thereto, to obtain a photosensitive glass substrate, wherein in the irradiating, an irradiation position of the energy beam is corrected based on a dimensional variation of the photosensitive glass caused by a heat treatment including at least the first heat treatment.

Abstract translation: 一种感光性玻璃基板的制造方法，其特征在于，包括：用能量束直接照射由感光性玻璃构成的板状基材，形成潜像; 通过第一次热处理使潜像结晶，得到结晶部分; 并溶解除去结晶部分并对其进行精细加工，以获得感光性玻璃基板，其中在照射中，基于由包括在...的热处理引起的感光玻璃的尺寸变化来校正能量束的照射位置 最少的热处理。

公开(公告)号：US20160185653A1

公开(公告)日：2016-06-30

申请号：US14911344

申请日：2014-08-27

Applicant: HOYA CORPORATION

Inventor： Takashi FUSHIE

IPC: C03C10/00 ,  C03B32/02 ,  C03B25/02 ,  C03C4/04

CPC classification number: C03C10/0027 ,  C03B25/025 ,  C03B32/02 ,  C03C3/095 ,  C03C4/04 ,  C04B35/16 ,  C04B2235/3203 ,  C04B2235/3418 ,  C04B2235/36 ,  C04B2235/6565 ,  C04B2235/781 ,  C04B2235/80 ,  C04B2235/96

Abstract: There is provided a silicate ceramics formed by crystallizing a silicate glass containing at least silicon oxide and lithium oxide, wherein a crystallinity of the silicate ceramics is 95% or more, and the silicate ceramics has a lithium disilicate crystal phase and α-quartz crystal phase, and further, regarding the ratio of the lithium disilicate crystal phase and the α-quartz crystal phase in the silicate ceramics, the lithium disilicate crystal phase has a larger weight ratio, and the silicate glass is preferably a photosensitive glass.

Abstract translation: 提供了通过使至少含有氧化硅和氧化锂的硅酸盐玻璃结晶而形成的硅酸盐陶瓷，其中硅酸盐陶瓷的结晶度为95％以上，硅酸盐陶瓷具有二硅酸锂晶相和α-石英晶相 此外，关于硅酸盐陶瓷中的二硅酸锂晶相和α-石英晶相的比例，二硅酸锂晶相的重量比大，硅酸盐玻璃优选为感光性玻璃。

公开(公告)号：US20130075146A1

公开(公告)日：2013-03-28

申请号：US13624448

申请日：2012-09-21

Applicant: Hoya Corporation

Inventor： Takashi FUSHIE ,  Hajime KIKUCHI

IPC: H05K3/40 ,  H05K3/00 ,  H05K1/11 ,  B32B3/24

CPC classification number: H05K1/115 ,  H05K1/0306 ,  H05K3/0017 ,  H05K3/002 ,  H05K3/0023 ,  H05K3/0029 ,  H05K3/381 ,  H05K3/423 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/2072 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y10T428/24273

Abstract: There is provided that a substrate comprising a glass substrate 2 constituted by a glass including a silicon oxide. The glass substrate has a through-hole 3 communicating with a front surface and a rear surface of the glass substrate, and filled with a metal material. The substrate is realized by forming an anchor part by selectively etching a silicon oxide on a sidewall surrounding an inside of said through-hole 3 before filling the metal material and by filling the inside of said through-hole 3 with the metal material after forming the anchor part.

Abstract translation: 提供了包括由包含氧化硅的玻璃构成的玻璃基板2的基板。 玻璃基板具有与玻璃基板的前表面和后表面连通并且填充有金属材料的通孔3。 通过在填充金属材料之前通过选择性地蚀刻围绕所述通孔3的内侧的侧壁上的氧化硅并且在形成所述金属材料之后用所述金属材料填充所述通孔3的内部来形成所述基板 主体部分。