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公开(公告)号:US20200256676A1
公开(公告)日:2020-08-13
申请号:US16847248
申请日:2020-04-13
Applicant: HRL Laboratories, LLC
Inventor: Lian X. HUANG , Logan SORENSON , Raviv PERAHIA , Hung NGUYEN , David T. CHANG
IPC: G01C19/5712 , G01C19/5677 , G01C19/5684
Abstract: A resonator includes an anchor, an outer stiffener ring on an outer perimeter of the resonator, and a plurality of curved springs between the anchor and the outer stiffener ring.
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公开(公告)号:US20240328838A1
公开(公告)日:2024-10-03
申请号:US18194051
申请日:2023-03-31
Applicant: HRL Laboratories, LLC
Inventor: Logan D. SORENSON , Patrick J. WEBB , Matthew J. PELLICCIONE , David T. CHANG , Raviv PERAHIA
CPC classification number: G01D11/30 , G01D11/245 , G01P15/14
Abstract: A sensor cluster is disclosed comprising a first plurality of side surfaces of a first N-hedron structure, and a second plurality of side surfaces of a second N-hedron structure. A first plurality of a first type of sensor are mounted on the first plurality of side surfaces, and a second plurality of a second type of sensor are mounted on the second plurality of side surfaces. N is greater than three and the first plurality of side surfaces are interleaved with the second plurality of side surfaces.
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公开(公告)号:US20190305749A1
公开(公告)日:2019-10-03
申请号:US16368802
申请日:2019-03-28
Applicant: HRL Laboratories, LLC
Inventor: Raviv PERAHIA , Logan D. Sorenson , Lian X. Huang , Jeremy Bregman
Abstract: A resonator has a resonator body and a frame at least partially surrounding the resonator body, the resonator body being coupled to the frame by at least one tether. The resonator body, frame and at least one tether comprise silicon carbide. A plurality of interdigitated electrodes are disposed on the silicon carbide resonator body. The resonator body preferably comprises 6H silicon carbide and preferably has a crystalline c-axis oriented generally parallel to a thickness direction of the resonator body.
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公开(公告)号:US20190305744A1
公开(公告)日:2019-10-03
申请号:US16368737
申请日:2019-03-28
Applicant: HRL Laboratories, LLC
Inventor: Raviv PERAHIA , Logan D. SORENSON , Lian X. HUANG , David T. CHANG , Makena S. WHITE , Jeremy BREGMAN
Abstract: A method of making a SiC resonator includes forming a layer of an oxide material on a relatively thick wafer of SiC; bonding the layer of oxide material on the relatively thick wafer of SiC to a handle wafer having at least an oxide exterior surface, the resulting bond being substantially free of voids; planarizing the relatively thick wafer of SiC to a desired thickness; forming top and bottom electrodes on the wafer of SiC wafer to define a SiC wafer resonator portion; and forming a trench around the top and bottom electrodes, the tench completely penetrating the planarized wafer of SiC around a majority of a distance surrounding said top and bottom electrodes, except for one or more tether regions of the planarized wafer of SiC which remain physically coupled a remaining portion the SiC wafer resonator portion which defines a frame formed of the planarized wafer of SiC surrounding the SiC wafer resonator portion.
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公开(公告)号:US20240329078A1
公开(公告)日:2024-10-03
申请号:US18194092
申请日:2023-03-31
Applicant: HRL Laboratories, LLC
Inventor: Logan D. SORENSON , Patrick J. WEBB , Matthew J. PELLICCIONE , David T. CHANG , Raviv PERAHIA
IPC: G01P21/00
CPC classification number: G01P21/00
Abstract: A computer system comprising N real sensors for generating N real sensor signals, and a multiplexer for selecting M of the real sensor signals from the N of real sensor signals, where M is less than N. The computer system further comprises a combiner for combining the M real sensor signals to generate a virtual sensor signal representing an output of one of the unselected N real sensors.
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6.
公开(公告)号:US20190315621A1
公开(公告)日:2019-10-17
申请号:US16376970
申请日:2019-04-05
Applicant: HRL Laboratories, LLC
Inventor: Deborah J. KIRBY , Raviv PERAHIA , Hung NGUYEN , Frederic P. STRATTON , David T. CHANG
Abstract: A device preferably for use in an inertial navigation system the device having a single IC wafer; a plurality of sensors bonded to bond regions on said single IC wafer, at least one of said bond regions including an opening therein in gaseous communication with a pressure chamber associated with at least one of the plurality of said sensors; and a plurality of caps encapsulating said plurality of sensors, at least one of said plurality of caps forming at least a portion of said pressure chamber. A method of making the device is also disclosed.
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7.
公开(公告)号:US20190072388A1
公开(公告)日:2019-03-07
申请号:US16102565
申请日:2018-08-13
Applicant: HRL Laboratories, LLC
Inventor: Lian X. HUANG , Logan D. SORENSON , Chia-Ming "Gavin" CHANG , Raviv PERAHIA , Hung NGUYEN , David T. CHANG
IPC: G01C19/5684
Abstract: A resonant structure comprising at least two coaxial rings, wherein adjacent coaxial rings have adjacent peripheries and are attached together by a plurality of connection structures regularly arranged along said adjacent peripheries; and wherein a first ring has a first ring portion with a first radial thickness and a second ring, portion, in a vicinity of a first connection structure, with a second radial thickness smaller than said first radial thickness.
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8.
公开(公告)号:US20190049246A1
公开(公告)日:2019-02-14
申请号:US16004310
申请日:2018-06-08
Applicant: HRL Laboratories, LLC
Inventor: Logan D. SORENSON , Hung Nguyen , Raviv PERAHIA , Lian X. Huang , David T. CHANG
IPC: G01C19/5684 , G01C19/5712
CPC classification number: G01C19/5684 , G01C19/025 , G01C19/5712
Abstract: An angular sensor, comprising a Coriolis vibratory gyroscope (CVG) resonator, capable of oscillating along a first pair of normal n=1 modes comprising a first normal mode and a second normal mode; and a second pair of normal n=2 modes comprising a third normal mode and a fourth normal mode; the sensor further comprising one drive electrode and one sense electrode aligned along an anti-nodal axis of each mode; and a pair of bias tune electrodes aligned with an anti-nodal axis of each mode if no drive and sense electrode pair is aligned with said anti-nodal axis.
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