公开(公告)号：US20140092562A1

公开(公告)日：2014-04-03

申请号：US14100374

申请日：2013-12-09

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yan XU ,  Baoguo Chen ,  Guoyuan Zhao

IPC: H05K7/20

CPC classification number: H05K7/209 ,  H01L23/36 ,  H01L2924/0002 ,  H05K7/2039 ,  H01L2924/00

Abstract: Embodiments of the present application provide an insulation and heat radiation structure of a power device, a circuit board, and a power supply apparatus. The insulation and heat radiation structure of the power device includes a power device, an insulation ceramic piece, and a heat radiator, where the power device is of a sheet structure, the insulation ceramic piece is an alumina ceramic piece, a heat radiator pin is disposed on the heat radiator, the heat radiator pin is used for being mechanically connected to the circuit board, a heating surface of the power device is adhesively fixed to one surface of the insulation ceramic piece through a first insulating thermal conductive adhesive, and the other surface of the insulation ceramic piece is adhesively fixed to a contact heat radiation surface of the heat radiator through a second insulating thermal conductive adhesive.

Abstract translation: 本发明的实施例提供功率器件，电路板和电源装置的绝缘和散热结构。 功率器件的绝缘和散热结构包括功率器件，绝缘陶瓷片和散热器，功率器件为片状结构，绝缘陶瓷片为氧化铝陶瓷片，散热片为 设置在散热器上，散热器引脚用于机械地连接到电路板，电力装置的加热面通过第一绝缘导热粘合剂粘合固定在绝缘陶瓷件的一个表面上，另一个 绝缘陶瓷片的表面通过第二绝缘导热粘合剂粘合地固定到散热器的接触放热表面。