Abstract:
A heat sink, which includes a first surface and a second surface opposite to the first surface, where the second surface includes a plurality of sub-surfaces, and each sub-surface is configured to be in contact with a surface of a heat emitting element; the plurality of sub-surfaces include a first sub-surface, a thickness between the first sub-surface and the first surface is less than a thickness between the first surface and each of the plurality of sub-surfaces except the first sub-surface; and the heat sink includes a plurality of layers of graphene sheets, each layer of graphene sheet includes a plurality of flake graphite particles, and two adjacent flake graphite particles located in a same layer of graphene sheet are covalently bonded.
Abstract:
According to the method for determining a redundant array of independent disks provided in the present invention, for an actual physical disk including n disk groups in which each disk group includes m disks, the n disk groups include m2*(m*n) logical blocks, and a logical block matrix corresponding to m distributed RAIDs can be generated. Therefore, a correspondence between the actual physical disk and the distributed RAIDs can be obtained. In a scenario of data storage or the like, a mapping relationship table of the physical disk and the RAIDs does not need to be stored, thereby saving storage space of a system, reducing maintenance costs, and improving reliability of the system.
Abstract:
The present invention provides an oriented flexible heat-conducting material, where main ingredients of the oriented flexible heat-conducting material are silicone rubber and anisotropic heat-conducting filler. Multiple continuous heat-conducting paths that are parallel to each other are formed in the oriented flexible heat-conducting material, and the heat-conducting paths are formed by continuously arranging the anisotropic heat-conducting filler, filled in the silicone rubber, in lines in a heat-conducting path direction. The oriented flexible heat-conducting material has a desirable heat-conducting property in a specific direction and has desirable flexibility, can be in desirable contact with an interface to produce quite low interface thermal resistance, and can greatly improve a heat dissipation effect. Embodiments of the present invention further provide a forming process and an application of the oriented flexible heat-conducting material.
Abstract:
The technology of this application relates to a packet processing method, a gateway device, and a storage system, and belongs to the field of storage technologies. In this disclosure, a request for accessing a non-volatile memory express (NVMe) node is converted into a request for accessing a remote direct memory access (RDMA) node. Because a storage medium of the NVMe node is a hard disk, and a storage medium of the RDMA node is a memory, the memory can provide a faster read/write speed than the hard disk. Therefore, storage performance is improved. In addition, this helps a conventional NVMe over fabrics (NOF) storage system expand an RDMA memory pool, and improves flexibility of networking and capacity expansion of the storage system.
Abstract:
A method for optimizing data access performance, which is applied to an intermediate device, is described. The intermediate device is a network device between a client and a server side, there are one or more clients and one or more server sides. The method includes the intermediate device parsing a received first packet to obtain a feature of the first packet, where the first packet is from a terminal on which one of the clients is located, the first packet is used to request data from one of the server sides, the feature indicates the data requested by using the first packet, and the feature is carried in a part that is of the first packet and that corresponds to application layer data. The method may also include, when the intermediate device stores the data requested by using the first packet, sending the data requested by using the first packet to the terminal.
Abstract:
Functionalized graphene is provided. The functionalized graphene is graphene onto whose surface one or more active molecules are grafted, the active molecule includes a plurality of terminal functional groups, and the plurality of terminal functional groups include at least two active functional groups. Because the active functional groups can chemically react with molecules in silicone oil, the functionalized graphene can evenly dissolve in the silicone oil, so that polyorganosiloxane prepared by using the functionalized graphene has good heat conduction performance. In addition, this application further provides a preparation method of the functionalized graphene and corresponding polyorganosiloxane.
Abstract:
A graphene fiber and a preparation method thereof, where the graphene fiber is a composite fiber of metal nanowire doped graphene fiber, and principal components of the composite fiber are graphene and metal nanowires, a mass ratio of metal nanowires is 0.1%-50%, the graphene is in a form of sheet, and both the metal nanowires and graphene sheets are arranged in parallel along an axial direction of the graphene fiber. The metal nanowire doped graphene fiber is a new type of a high performance multi-functional fiber material, which achieves a significant improvement in electrical conductivity of graphene fibers through doping of metal nanowires and meanwhile demonstrates excellent tensile strength and toughness. The metal nanowire doped graphene fiber has great potential application value in a plurality of fields, for example, it is used as a lightweight flexible wire.
Abstract:
Embodiments of the present application provide an insulation and heat radiation structure of a power device, a circuit board, and a power supply apparatus. The insulation and heat radiation structure of the power device includes a power device, an insulation ceramic piece, and a heat radiator, where the power device is of a sheet structure, the insulation ceramic piece is an alumina ceramic piece, a heat radiator pin is disposed on the heat radiator, the heat radiator pin is used for being mechanically connected to the circuit board, a heating surface of the power device is adhesively fixed to one surface of the insulation ceramic piece through a first insulating thermal conductive adhesive, and the other surface of the insulation ceramic piece is adhesively fixed to a contact heat radiation surface of the heat radiator through a second insulating thermal conductive adhesive.
Abstract:
This application discloses a packet processing method, comprising: A storage server receives a first packet, where the first packet includes a first service layer and a check value of the first service layer, and the first service layer includes payload data. The storage server obtains a check value of the payload data through calculation based on the first service layer and/or the check value of the first service layer. The storage server sends a second packet to a gateway device, where the second packet includes a second service layer, a check value of the second service layer, and the check value of the payload data, the second service layer is obtained based on the first service layer, and the check value of the second service layer is obtained through calculation based on the second service layer and the check value of the payload data.
Abstract:
A method and an apparatus for processing a forwarding entry are provided. The method for processing a forwarding entry includes: receiving an entry operation packet through a first data channel; parsing the entry operation packet to obtain forwarding entry operation information; and performing a target operation on a memory based on the forwarding entry operation information, where the target operation includes adding an entry, deleting an entry, or modifying an entry.