公开(公告)号：US20230363087A1

公开(公告)日：2023-11-09

申请号：US18246036

申请日：2021-09-07

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Hongbin Shi ,  Xin Guo ,  Lixiang Wang ,  Haisheng Tu ,  Benyin Zheng

IPC: H05K1/02 ,  H05K1/14 ,  H05K5/03

CPC classification number: H05K1/0298 ,  H05K1/144 ,  H05K5/03

Abstract: This application provides a printed circuit board assembly and an electronic device. The printed circuit board assembly includes: a printed circuit board, where the printed circuit board includes a functional network, and the functional network is configured to provide an electrical function; a conductive part, where the conductive part is connected to the printed circuit board and is electrically connected in parallel to the functional network; and a cover-shaped structure, where the cover-shaped structure covers the conductive part and is connected to the printed circuit board, and the cover-shaped structure is configured to prevent the conductive part located in the cover-shaped structure from contacting a conductor outside the cover-shaped structure. The foregoing technical solutions can reduce impedance of a circuit board, improve a current utilization, and further improve mechanical reliability of the circuit board.