公开(公告)号：US20230275003A1

公开(公告)日：2023-08-31

申请号：US18144580

申请日：2023-05-08

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Qiuzhi LIU ,  Fei YU ,  Chaojun RAO ,  Song YANG

IPC: H01L23/40 ,  H01L23/04

CPC classification number: H01L23/4006 ,  H01L23/04 ,  H01L2023/4087

Abstract: A heat dissipation assembly includes: a heat spreader, configured to be in contact with an element; a frame body, configured to limit a position of the heat spreader, where the frame body surrounds a side wall of the heat spreader; and an elastic structure, fixedly connected to the frame body. In this application, the heat spreader is disposed, so that heat generated by the element can be evenly conducted; furthermore, the elastic structure fixedly connected to the frame body is disposed, so that the element, the heat spreader, and the frame body are reliably fastened in a thickness direction, to ensure that heat generated by the element can be smoothly conducted. In addition, because a requirement on adhesion strength of a heat conducting material is reduced, a heat conducting material with better heat dissipation performance can be selected, thereby further improving and heat dissipation efficiency of a chip is further improved.