公开(公告)号：US11713239B2

公开(公告)日：2023-08-01

申请号：US16915601

申请日：2020-06-29

Applicant: HUAWEI TECHNOLOGIES CO., LTD. ,  Wuxi WiO Technologies Co., Ltd.

Inventor： Yiwen Chen ,  Zhaoxing Huang ,  Danyang Yao ,  Hong Tang ,  Chendi Jiang ,  Huikai Xie

IPC: B81B3/00 ,  B81B7/00 ,  B81B7/02 ,  G02B26/08

CPC classification number: B81B7/02 ,  B81B3/0081 ,  B81B3/0083 ,  B81B2201/042 ,  B81B2201/045 ,  B81B2203/0323 ,  G02B26/0866

Abstract: This application discloses a MEMS chip structure, including a substrate, a side wall, a dielectric plate, a MEMS micromirror array, and a grid array, where the MEMS micromirror array includes a plurality of grooves and a plurality of MEMS micromirrors. The plurality of MEMS micromirrors are in a one-to-one correspondence with the plurality of grooves. The grid array is located above the MEMS micromirror array, and a lower surface of the grid array is connected to upper surfaces of side walls of at least some of the plurality of grooves.

公开(公告)号：US12196600B2

公开(公告)日：2025-01-14

申请号：US17974326

申请日：2022-10-26

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Zhihong Feng ,  Danyang Yao ,  Jinghui Xu

IPC: G01H11/08 ,  H04R17/02 ,  H04R31/00

Abstract: This application discloses example piezoelectric acoustic sensors and methods for manufacturing the piezoelectric acoustic sensor, and belongs to the field of electronic technologies. In one example, the piezoelectric acoustic sensor includes an anchoring unit, a piezoelectric unit, a support unit, and a hollow-out mechanical part. A back cavity is formed in the anchoring unit. The piezoelectric unit is configured to convert a sound signal that enters the back cavity into an electrical signal. The support unit covers the anchoring unit and the piezoelectric unit. The hollow-out mechanical part is connected between the anchoring unit and the piezoelectric unit, and is embedded in the support unit.

公开(公告)号：US20220264229A1

公开(公告)日：2022-08-18

申请号：US17733148

申请日：2022-04-29

Applicant: Huawei Technologies Co., Ltd.

Inventor： Danyang Yao ,  Jinghui Xu

IPC: H04R17/00 ,  B81B7/02 ,  H01L41/113

Abstract: A piezoelectric MEMS sensor and a related device is disclosed, applied to scenarios such as a terminal, a smart acoustic system, a wireless Bluetooth headset, an active noise reduction headset, a notebook computer, and an automobile industry, including a substrate including a sound entry channel and at least one cantilever. The cantilever includes a first region and a second region that are connected to each other. The first region includes a first side face and a second side face, the first side face is a side face that is of the first region and that faces a target face, and the target face is a face that is of the cantilever and that is connected to the substrate. An included angle between the first side face and the second side face is greater than or equal to 90 degrees and less than 180 degrees.