公开(公告)号：US20230194347A1

公开(公告)日：2023-06-22

申请号：US18170217

申请日：2023-02-16

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Hui YANG ,  Haisong XU ,  Yang LU ,  Zhengnan YE

IPC: G01J3/28 ,  H04N23/12 ,  H04N23/84

CPC classification number: G01J3/2823 ,  H04N23/12 ,  H04N23/84 ,  G01J2003/2826

Abstract: This disclosure discloses image sensors, signal processing methods, and related devices for image processing. An example image sensor comprises an optical filter array. The optical filter array is a hyper spectral or multispectral optical filter array and comprises m optical filters and an optical-to-electrical conversion module. The optical-to-electrical conversion module comprises an optical-to-electrical conversion unit and a combining unit. The m optical filters are configured to obtain optical signals of a target object in at least two different spectral bands. The optical-to-electrical conversion unit is configured to convert the optical signals obtained by the m optical filters into electrical signals. The combining unit is configured to combine the electrical signals corresponding to the m optical filters to obtain a combined electrical signal. The optical-to-electrical conversion module is configured to output the combined electrical signal, which is used to generate an image of the target object.