Vehicle control system using imaging device capable of object detection

    公开(公告)号:US12108172B2

    公开(公告)日:2024-10-01

    申请号:US17760189

    申请日:2021-01-14

    Inventor: Kei Nakagawa

    CPC classification number: H04N25/57 H04N7/18 H04N23/12 H04N23/60

    Abstract: An imaging device of the present disclosure includes a pixel array part in which pixels including photoelectric conversion units are disposed, an image processing unit for imaging that acquires captured image information on the basis of a pixel signal output from each pixel of the pixel array part, and an object recognition processing unit that acquires object recognition information on the basis of the pixel signal output from each pixel of the pixel array part. Further, a vehicle control system of the present disclosure has the imaging device having the aforementioned configuration.

    IMAGING APPARATUS
    6.
    发明公开
    IMAGING APPARATUS 审中-公开

    公开(公告)号:US20240056690A1

    公开(公告)日:2024-02-15

    申请号:US18258033

    申请日:2021-11-16

    CPC classification number: H04N23/73 H04N25/534 H04N23/12 H04N23/71

    Abstract: An imaging apparatus according to the present disclosure includes a multi-spectral sensor that outputs multiple wavelength signals, a detection circuit that detects a luminance signal in accordance with a spectral characteristic of a desired object on the basis of a detection signal generated using the multiple wavelength signals outputted from the multi-spectral sensor, and a control circuit that performs exposure control in accordance with the spectral characteristic of the desired object on the basis of a detection value of the detection circuit.

    IMAGE SENSOR PACKAGE AND CAMERA DEVICE COMPRISING SAME

    公开(公告)号:US20230276112A1

    公开(公告)日:2023-08-31

    申请号:US18014626

    申请日:2021-05-06

    Abstract: An image sensor package, according to one embodiment of the present invention, comprises: a printed circuit board; an image sensor disposed on the printed circuit board; a first support part disposed on the image sensor; a filter layer disposed on the image sensor; a second support part disposed on the printed circuit board, to the side of the image sensor; a wire part which is disposed between the first support part and the second support part, and of which one end is connected to the image sensor and the other end is connected to the printed circuit board; and a molding member filling the gap between the first support part and the second support part.

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