公开(公告)号：US20230420900A1

公开(公告)日：2023-12-28

申请号：US18466835

申请日：2023-09-14

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Zongxun Chen ,  Jiankang Li ,  Huan Pei ,  Jiang Zhu

IPC: H01R33/76 ,  H01R13/652 ,  H01R12/57 ,  H01R12/71 ,  H01R13/6587

CPC classification number: H01R33/7664 ,  H01R13/652 ,  H01R12/57 ,  H01R12/716 ,  H01R13/6587

Abstract: An electronic assembly includes a first electronic component, a second electronic component, and an electrical connector connecting the first electronic component and the second electronic component. The electrical connector includes a first multilayer circuit board and a terminal that includes a plurality of signal terminals and a plurality of ground terminals. Each signal terminal is electrically connected to a signal interface of the first electronic component and a signal interface of the second electronic component. Signal terminals configured to transmit a same signal form one group of signal terminals, and at least one ground terminal is disposed between two adjacent groups of signal terminals. The first multilayer circuit board includes at least one layer of first ground copper sheet. The first electronic component includes a second multilayer circuit board, and the second multilayer circuit board includes at least one layer of second ground copper sheet.