公开(公告)号：US10923877B2

公开(公告)日：2021-02-16

申请号：US15855334

申请日：2017-12-27

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Kaisheng Chen ,  Hongmin Chen

IPC: G02B6/42 ,  H01S5/026 ,  H01S5/10 ,  H01S5/02 ,  H01S5/022 ,  H01S5/00 ,  H01S5/0683 ,  G02B6/12 ,  G02B6/125 ,  H01S5/06

Abstract: Embodiments of the present disclosure relate to a surface-mount laser apparatus. One example apparatus includes an on-chip laser, a passive waveguide, and a waveguide detector. The waveguide detector includes a first ridge waveguide. The on-chip laser includes a second ridge waveguide. The on-chip laser is coupled with the passive waveguide by the second ridge waveguide, and the waveguide detector is coupled with the passive waveguide by the first ridge waveguide.