公开(公告)号：US20240319559A1

公开(公告)日：2024-09-26

申请号：US18734566

申请日：2024-06-05

申请人： HUAWEI TECHNOLOGIES CO., LTD.

发明人： Limin CHANG ,  Hongmin CHEN ,  Mengdie SUN ,  Li YANG ,  Xin CHEN ,  Jun YUAN

IPC分类号： G02F1/225 ,  G02B6/42 ,  G02F1/01 ,  G02F1/035

CPC分类号： G02F1/2257 ,  G02F1/0121 ,  G02F1/035 ,  G02B6/4295 ,  G02F2202/105

摘要： An example chip may include a substrate, an insulation layer located on a side of the substrate, and a first waveguide and a second waveguide that are in the insulation layer. The second waveguide is located on a side of the first waveguide away from the substrate. A transmission loss of the second waveguide is smaller than a transmission loss of the first waveguide. A first coupling portion of the first waveguide and a second coupling portion of the second waveguide form a first coupling structure, and the first coupling structure is configured to implement optical coupling between the first waveguide and the second waveguide.