HEAT CONDUCTING PART AND ELECTRONIC DEVICE

    公开(公告)号:US20220087073A1

    公开(公告)日:2022-03-17

    申请号:US17536672

    申请日:2021-11-29

    Abstract: A heat conducting part is provided. The heat conducting part includes a shell, including an inner layer and an outer layer, where a cavity is enclosed by the inner layer, and the outer layer wraps a periphery of the inner layer; a capillary structure, disposed in the cavity and abutting against the shell; and cooling liquid, located in the cavity, where the inner layer and the outer layer are made of different materials, and a material density of the outer layer is lower than a material density of the inner layer. In the heat conducting part provided in this application, a material with a relatively large density and a stable chemical property may be selected for the inner layer to ensure durability of the heat conducting part.

    LIGHTWEIGHT STEEL AND PREPARATION METHOD THEREOF, STEEL STRUCTURAL PART, AND ELECTRONIC DEVICE

    公开(公告)号:US20240200174A1

    公开(公告)日:2024-06-20

    申请号:US18587584

    申请日:2024-02-26

    CPC classification number: C22C30/00

    Abstract: This application relates to lightweight steels, preparation methods thereof, and steel structural parts and electronic devices that use the lightweight steel. An example light weight steal includes: Fe, in a percentage by weight greater than or equal to 48.18 wt %; Mn, in a percentage by weight of 30.01 wt % to 35.01 wt %; Al, in a percentage by weight of 12.01 wt % to 15.01 wt %; C, in a percentage by weight of 1.0 wt % to 1.5 wt %; and O, in a percentage by weight of 0.03 wt % to 0.3 wt %. This application further provides a steel structural part, an electronic device that use the lightweight steel, and a preparation method of the lightweight steel.

    MIDDLE FRAME MEMBER AND METHOD FOR MANUFACTURING MIDDLE FRAME MEMBER

    公开(公告)号:US20180255664A1

    公开(公告)日:2018-09-06

    申请号:US15971914

    申请日:2018-05-04

    Abstract: Embodiments of the present disclosure provide a middle frame member including: a middle frame substrate body; a first metal layer, attached to a first area of the middle frame substrate body, where a coefficient of heat conductivity of the first metal layer is greater than a coefficient of heat conductivity of the middle frame substrate body, the first area includes all or a part of an outer surface of the middle frame substrate body, and the first metal layer is used to conduct, to the entire first metal and the middle frame substrate body, heat generated by at least one of the components that is in contact with or adjacent to the first metal layer; and a passivated insulation layer, attached to a surface of the first metal layer.

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