公开(公告)号：US20240040751A1

公开(公告)日：2024-02-01

申请号：US18484580

申请日：2023-10-11

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Ming CHENG ,  Buping YUAN ,  Chengpeng YANG ,  Yuping HONG ,  Qinghe ZHANG

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K7/205 ,  H05K1/021 ,  H05K2201/10121

Abstract: A heat conducting member is provided. The heat conducting member provided in this application includes a substrate and a heat conducting layer. The substrate includes a heat conducting surface. The heat conducting layer includes a transition layer and a protective layer. The transition layer is disposed on the heat conducting surface, and the protective layer is disposed on a surface that is of the transition layer and that is away from the heat conducting surface. Roughness Ra of the protective layer is less than or equal to 0.4. The transition layer can provide a hardness transition function between the substrate and the protective layer, to facilitate improving overall hardness of the heat conducting member. The protective layer may ensure surface hardness, to prevent an undesirable situation such as a scratch.