公开(公告)号：US20240321771A1

公开(公告)日：2024-09-26

申请号：US18734122

申请日：2024-06-05

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Bai DU ,  Zhongli JI ,  Fei SHE ,  Ruilin LI ,  Qingchao GUO

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L23/552 ,  H01L23/3135 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15333

Abstract: A chip system includes a chip package body and an electromagnetic shielding enclosure. The chip package body is electrically connected to a circuit board through a first connection part. The chip package body includes a package substrate and at least one chip that are electrically connected. The electromagnetic shielding enclosure includes a conductive first shielding structure and a conductive second shielding structure. The first shielding structure is connected to the package substrate. A first cavity included in the first shielding structure is configured to accommodate at least one chip. A first end of the second shielding structure is connected to the circuit board or a solder pad of the circuit board; or a second end of the second shielding structure is connected to the first shielding structure to form a second cavity.