公开(公告)号：US20230354506A1

公开(公告)日：2023-11-02

申请号：US18350812

申请日：2023-07-12

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Feng GAO ,  Shichao TAO ,  Mingli HUANG

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K1/024 ,  H05K1/115 ,  H05K3/0047 ,  H05K3/42 ,  H05K2201/0355 ,  H05K2201/10098

Abstract: This application provides a printed circuit board and an electronic communication device. The printed circuit board includes a substrate, a bonding layer, a copper foil, and a filler. The substrate is provided with a cavity, and the cavity penetrates through the substrate. Two surfaces of the substrate are covered with the copper foil. The copper foil is bonded to the substrate by using the bonding layer. An outer surface of the copper foil is plated with a conductive metal layer. The filler is located inside the cavity. The substrate is provided with a through hole, and the through hole penetrates through the substrate and the bonding layer. A hole wall of the through hole is plated with a conductive metal layer. In this application, a dielectric constant Dk and a dielectric loss Df of the printed circuit board can be effectively reduced, and cost control is ensured.