公开(公告)号：US20190223311A1

公开(公告)日：2019-07-18

申请号：US16366726

申请日：2019-03-27

申请人： HUAWEI TECHNOLOGIES CO., LTD.

发明人： Wenming SHI ,  Wangchun LV ,  Yongxiang WANG ,  Kaiwen HUANG

IPC分类号： H05K5/04 ,  H01Q1/27 ,  H04M1/02 ,  H05K5/03 ,  H05K5/00

CPC分类号： H05K5/04 ,  G02B6/0031 ,  H01Q1/243 ,  H01Q1/273 ,  H04M1/02 ,  H04M1/0249 ,  H04M1/026 ,  H04M1/0283 ,  H05K5/0086 ,  H05K5/03

摘要： A metal enclosure of a mobile device, a production method for the metal enclosure, and a mobile device are disclosed. The metal enclosure of a mobile device includes a housing, where at least one gap is disposed on the housing, and the at least one gap divides the housing into at least two electrically insulated parts. The metal enclosure further includes an insulation film attached to a surface of the housing. In the foregoing embodiments, the gap is provided on the housing, so that the housing is divided into the at least two electrically insulated parts. Each gap is filled with an insulation object, and the gap on the surface of the housing and the insulation object in the gap form a partition.