公开(公告)号：US20240008340A1

公开(公告)日：2024-01-04

申请号：US18247232

申请日：2021-09-02

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Sulin YANG ,  Yapeng LI

IPC: H10K59/60 ,  H10K59/12 ,  H10K59/35 ,  H10K59/40 ,  A61B5/0205

CPC classification number: H10K59/60 ,  H10K59/12 ,  H10K59/353 ,  H10K59/40 ,  A61B5/0205 ,  A61B5/02416

Abstract: An electronic device includes a body and a PPG sensor. The PPG sensor includes: a substrate, a first electrode, a light emitting layer, a light receiving layer, a second transparent electrode, and a transparent panel that are integrally packaged. The substrate and the first electrode are both located on one side of the light emitting layer, and the second transparent electrode and the transparent panel are both located on the other side of the light emitting layer. The light receiving layer, the first electrode, and the second transparent electrode are all located between the substrate and the transparent panel, and a polarity of the first electrode and a polarity of the second transparent electrode are opposite. The light emitting layer includes a light emitting pixel for emitting an optical signal, and the light receiving layer includes a light receiving pixel for detecting the optical signal.

公开(公告)号：US20230058372A1

公开(公告)日：2023-02-23

申请号：US17793869

申请日：2020-12-10

Applicant: Huawei Technologies Co., Ltd.

Inventor： Jiewei LI ,  Weibo JIA ,  Yapeng LI ,  Lubing XIE

IPC: G06F1/20 ,  G06F3/041 ,  H05K7/20

Abstract: A touch module is provided, which includes a base layer, an intermediate layer, and a touch layer. The intermediate layer is mounted on the base layer, and the touch layer is mounted on the intermediate layer. The intermediate layer has a heat dissipation substrate and foam that are attached to each other, the heat dissipation substrate has an etched surface and a back surface that are opposite to each other, and a near field communication coil is etched on the etched surface. A terminal device including a housing and a display panel is also provided. The display panel is disposed on the housing, and the touch module is disposed on the display panel. The near field communication coil is integrated on the heat dissipation substrate.