公开(公告)号：US20220375821A1

公开(公告)日：2022-11-24

申请号：US17748074

申请日：2022-05-19

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Zhaokuan LIANG ,  Liang ZHANG ,  Zelong JIAO ,  Yatao ZHAO ,  Chunyang LI

IPC: H01L23/40 ,  H01L25/065 ,  H05K1/18 ,  H01L21/48

Abstract: This application discloses a board, an electronic device, and a manufacturing method, and pertains to the field of bare die package technologies. The board includes a PCB assembly, a bare die, a reinforcing frame, a heat sink, and fasteners. Both the bare die and the reinforcing frame are located on a surface of the PCB assembly, the bare die is located in the reinforcing frame, and the reinforcing frame is fixedly connected to the PCB assembly by using the fastener. The heat sink is located on a surface of the bare die that is away from the PCB assembly, and the heat sink is fixedly connected to the reinforcing frame by using the fastener.