公开(公告)号：US20220375821A1

公开(公告)日：2022-11-24

申请号：US17748074

申请日：2022-05-19

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Zhaokuan LIANG ,  Liang ZHANG ,  Zelong JIAO ,  Yatao ZHAO ,  Chunyang LI

IPC: H01L23/40 ,  H01L25/065 ,  H05K1/18 ,  H01L21/48

Abstract: This application discloses a board, an electronic device, and a manufacturing method, and pertains to the field of bare die package technologies. The board includes a PCB assembly, a bare die, a reinforcing frame, a heat sink, and fasteners. Both the bare die and the reinforcing frame are located on a surface of the PCB assembly, the bare die is located in the reinforcing frame, and the reinforcing frame is fixedly connected to the PCB assembly by using the fastener. The heat sink is located on a surface of the bare die that is away from the PCB assembly, and the heat sink is fixedly connected to the reinforcing frame by using the fastener.

公开(公告)号：US20240357773A1

公开(公告)日：2024-10-24

申请号：US18758053

申请日：2024-06-28

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Zelong JIAO ,  Lujun ZHOU ,  Guangming ZHENG ,  Fei MA

IPC: H05K7/20

CPC classification number: H05K7/20772 ,  H05K7/20254 ,  H05K7/20263 ,  H05K7/20272 ,  H05K7/20727

Abstract: The technology of this application relates to, at least, a cooling module. The cooling module includes a liquid mixing cavity, a first and a second cooling plate. The first cooling plate is disposed on a side of a first chip and is fastened to the first chip. The second cooling plate is disposed on a side of a second chip and is fastened to the second chip. A temperature of the first chip is not equal to a temperature of the second chip. A flow channel is provided in each of the first cooling plate and the second cooling plate. The first cooling plate and the second cooling plate are each provided with a liquid outlet and a liquid return opening that are communicated with the flow channel. Both the liquid outlet and the liquid return opening are communicated with the liquid mixing cavity. A liquid medium flows between the flow channel and the liquid mixing cavity.

公开(公告)号：US20220256727A1

公开(公告)日：2022-08-11

申请号：US17732665

申请日：2022-04-29

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Xuguang YANG ,  Zhiwen YANG ,  Shaohua ZHANG ,  Zelong JIAO

IPC: H05K7/14

Abstract: An interconnection structure used in an electronic device includes a chassis, a first line board, a second line board, and a heat dissipation component. The heat dissipation component is disposed on a first side surface of the chassis, the first side surface includes a first opening, the second line board is horizontally disposed inside the chassis, the first line board is vertically inserted onto a side surface of the second line board, and a second side surface that is of the chassis and that is opposite to the first side surface includes a second opening. The second line board is horizontally disposed inside the chassis, and the first line board is vertically inserted onto the side surface of the second line board, to reduce a quantity of parts on a system air duct, reduce a flow resistance of a system, and improve a heat dissipation capability of the system.