公开(公告)号：US20230254044A1

公开(公告)日：2023-08-10

申请号：US18299166

申请日：2023-04-12

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yuanbing CHENG ,  Yuanfeng MAO ,  Guangcan CHEN

IPC: H04B10/50 ,  H01S5/0683 ,  H01S5/40 ,  H01S5/00 ,  H01S5/024

CPC classification number: H04B10/503 ,  H01S5/06837 ,  H01S5/4006 ,  H01S5/0085 ,  H01S5/02415 ,  H01S5/0064

Abstract: A laser chip includes a first power detector, a first controller, an optical splitter, a polarization splitter-rotator, a bandpass filter, and a slave laser. The optical splitter includes a first, a second, and a third port. The first port is configured to receive injection light of a master laser. The second port is connected to the first power detector. The optical splitter is configured such that the injection light enters the optical splitter through the first port, and is output to the polarization splitter-rotator through the third port. The polarization splitter-rotator is configured to perform optical splitting and polarization conversion on the injection light. The polarization splitter-rotator includes a first waveguide configured to transmit TE mode injection light after the injection light is split by the polarization splitter-rotator, and a second waveguide configured to transmit TM mode injection light after the injection light is split by the polarization splitter-rotator.