公开(公告)号：US20240291231A1

公开(公告)日：2024-08-29

申请号：US18586203

申请日：2024-02-23

申请人： NICHIA CORPORATION

发明人： Tadayuki KITAJIMA ,  Kazuma KOZURU

IPC分类号： H01S5/0239 ,  H01S5/00

CPC分类号： H01S5/0239 ,  H01S5/0064 ,  H01S5/0087

摘要： A light-emitting device includes a base member, a light-emitting element, and a cover. The cover has a lateral portion surrounding a periphery of the light-emitting element and an upper portion arranged above the light-emitting element. The cover includes a wavelength conversion member and a light-shielding member. The wavelength conversion member has an incident surface where the light emitted from the light-emitting element in the lateral direction is incident, at least a part of the wavelength conversion member constituting at least a part of the upper portion of the cover. A straight line, which passes through a light-emitting point of the light-emitting element and is parallel to an optical axis direction, passes through a part of the light-shielding member. At least the part of the light-shielding member is located, relative to the wavelength conversion member, on a side opposite from the light-emitting element in the optical axis direction.

公开(公告)号：US12038511B2

公开(公告)日：2024-07-16

申请号：US17505640

申请日：2021-10-20

申请人： Intel Corporation

发明人： Naresh Satyan ,  George Rakuljic

IPC分类号： G01C3/08 ,  G01S7/481 ,  G01S7/4911 ,  G01S7/4914 ,  G01S7/4915 ,  G01S7/497 ,  G01S17/34 ,  G01S17/42 ,  G01S17/89 ,  G02F1/21 ,  H01S5/026 ,  H01S5/10 ,  H01S5/00 ,  H01S5/12 ,  H01S5/50

CPC分类号： G01S17/89 ,  G01S7/4812 ,  G01S7/4817 ,  G01S7/4911 ,  G01S7/4914 ,  G01S7/4915 ,  G01S7/497 ,  G01S17/34 ,  G01S17/42 ,  G02F1/21 ,  H01S5/0261 ,  H01S5/0265 ,  H01S5/1014 ,  G01S7/4818 ,  G02F1/212 ,  H01S5/0064 ,  H01S5/1212 ,  H01S5/5027

摘要： A light detection and ranging (LIDAR) system may include a laser source configured to emit one or more optical beams; a scanning optical system configured to scan the one or more optical beams over a scene and capture reflections of the one or more optical beams from the scene; a measurement system configured to divide the scene into a plurality of pixels, the measurement system comprising a detector configured to detect a return signal from multiple pixels of the plurality of pixels as the one or more optical beams are scanned across the scene, and a data processor configured to perform data processing from the return signal from the multiple pixels to determine a range and/or range rate for each pixel of the scene.

公开(公告)号：US11899256B2

公开(公告)日：2024-02-13

申请号：US18093468

申请日：2023-01-05

申请人： NEC Corporation

发明人： Isao Tomita

IPC分类号： G02B6/42 ,  H04B10/40 ,  H04B10/61 ,  H01S5/02251 ,  H01S5/0239 ,  H01S5/50 ,  H01S5/00 ,  H01S5/14 ,  H01S5/02216 ,  G02F1/01 ,  H01S5/022 ,  G02F2/00

CPC分类号： G02B6/4292 ,  G02B6/42 ,  G02B6/4246 ,  H01S5/0239 ,  H01S5/02251 ,  H01S5/50 ,  H04B10/40 ,  H04B10/61 ,  G02F1/01 ,  G02F2/00 ,  H01S5/005 ,  H01S5/0064 ,  H01S5/0071 ,  H01S5/022 ,  H01S5/02216 ,  H01S5/142

摘要： A pluggable optical connector is configured to be insertable into and removable from an optical communication apparatus, and to be capable of communicating a modulation signal and a data signal with the optical communication apparatus. A wavelength-tunable light source is configured to output an output light and a local oscillation light. An optical transmission unit is configured to output an optical signal generated by modulating the output light in response to the modulation signal. An optical reception unit is configured to demodulate an optical signal received by using the local oscillation light to the data signal. Pluggable optical receptors are configured in such a manner that an optical fiber is insertable into and removable from the pluggable optical receptors, and configured to be capable of outputting the optical signal to the optical fiber and transferring the optical signal received thorough the optical fiber to the optical reception unit.

公开(公告)号：US20230361526A1

公开(公告)日：2023-11-09

申请号：US18190318

申请日：2023-03-27

申请人： Yuanjie Semiconductor Technology Co., Ltd.

发明人： Mahui LI ,  YENTING PAN ,  Yao MU ,  Yuchen SHI ,  Haichao ZHANG

IPC分类号： H01S5/50 ,  H01S5/026 ,  H01S5/00

CPC分类号： H01S5/0064 ,  H01S5/0085 ,  H01S5/0265 ,  H01S5/50

摘要： The disclosure belongs to the technical field of photoelectric emission in semiconductors, and discloses an electro-absorption modulated laser chip and a fabrication method thereof, which can solve the problems of signal distortion caused by optical crosstalk between components in an existing electro-absorption modulated laser (EML) integrated with a semiconductor optical amplifier (SOA), and failure in longer-distance transmission. The laser chip includes: a laser light source; an electro-absorption modulator disposed on a light-emitting side of the laser light source; a semiconductor optical amplifier disposed on a light-emitting side of the electro-absorption modulator; and at least one isolation assembly disposed between the laser light source and the electro-absorption modulator, and/or, disposed between the electro-absorption modulator and the semiconductor optical amplifier, and configured to isolate optical crosstalk among the laser light source, the electro-absorption modulator, and the semiconductor optical amplifier. The disclosure is used for the electro-absorption modulated laser chip.

公开(公告)号：US20230246422A1

公开(公告)日：2023-08-03

申请号：US18077355

申请日：2022-12-08

申请人： HAMAMATSU PHOTONICS K.K.

发明人： Atsushi SUGIYAMA

IPC分类号： H01S5/34 ,  H01S5/20 ,  H01S5/00 ,  G02B1/115

CPC分类号： H01S5/3401 ,  H01S5/2031 ,  H01S5/204 ,  H01S5/0064 ,  G02B1/115

摘要： A quantum cascade laser element includes: a semiconductor substrate; a semiconductor laminate including an active layer and having a first end surface and a second end surface facing each other in an optical waveguide direction; a first electrode; a second electrode; and an anti-reflection film formed on the first end surface. The semiconductor laminate is configured to oscillate laser light having a central wavelength of 7.5 μm or more. The anti-reflection film includes at least one of at least one layer of a CeO2 film formed by continuous sputtering and vacuum evaporation and a plurality of layers of CeO2 films formed by discrete sputtering and vacuum evaporation.

公开(公告)号：US20230238770A1

公开(公告)日：2023-07-27

申请号：US18099687

申请日：2023-01-20

申请人： MATERION CORPORATION

发明人： Reto KELLER ,  Richard KOBA ,  Daniel MARXER ,  Simon STAHEL

IPC分类号： H01S5/02257 ,  H01S5/02208 ,  H01S5/00

CPC分类号： H01S5/02257 ,  H01S5/02208 ,  H01S5/0064 ,  H01S5/023

摘要： Provided herein is a semiconductor package and method of forming the same. The semiconductor package has a cap including a first window wafer with a first face and opposing second face, a second window wafer, and a perforated spacer wafer with through-holes extending therethrough. The first and second faces of the first window wafer are mutually parallel and at least one face includes an antireflective surface. The spacer wafer is disposed between the first and second window wafers with the first and second window wafers bonded to opposing faces of the spacer wafer. The window wafers and spacer wafer together define a cavity in the cap. An edge-emitting laser diode is disposed on a submount and configured to direct a laser beam at normal incidence to the first face of the first window wafer. The cap is mounted on the submount with the edge-emitting laser diode enclosed in the cavity.

公开(公告)号：US20190207362A1

公开(公告)日：2019-07-04

申请号：US16295923

申请日：2019-03-07

申请人： Finisar Corporation

发明人： Duanhua Kong ,  Daniel Mahgerefteh ,  Shiyun Lin ,  Yasuhiro Matsui

IPC分类号： H01S5/026 ,  H01S5/00 ,  G02B6/34 ,  G02B6/12 ,  G02B6/122

CPC分类号： H01S5/026 ,  G02B6/12004 ,  G02B6/122 ,  G02B6/34 ,  H01S5/0064

摘要： A system includes a grating coupled laser and a photonic integrated circuit (PIC). The grating coupled laser includes a first waveguide and a transmit grating coupler optically coupled to the first waveguide. The PIC includes a second waveguide and a receive grating coupler optically coupled to the second waveguide. The receive grating coupler is in optical alignment with the transmit grating coupler. The receive grating coupler includes a first grating and a second grating spaced apart from and above the first grating within the PIC.

公开(公告)号：US10061092B2

公开(公告)日：2018-08-28

申请号：US15653954

申请日：2017-07-19

申请人： FURUKAWA ELECTRIC CO., LTD.

发明人： Yuta Ishige ,  Naoki Hayamizu ,  Etsuji Katayama ,  Toshio Kimura

IPC分类号： G02B6/42 ,  H01S5/00 ,  H01S5/022 ,  G02B6/26 ,  H01S5/40

CPC分类号： G02B6/4206 ,  G02B6/243 ,  G02B6/262 ,  G02B6/4215 ,  G02B6/4236 ,  G02B6/4257 ,  G02B6/4296 ,  H01S5/0064 ,  H01S5/0071 ,  H01S5/0078 ,  H01S5/02216 ,  H01S5/02252 ,  H01S5/02284 ,  H01S5/02469 ,  H01S5/4012 ,  H01S5/4043

摘要： A semiconductor laser module includes a package; a plurality of semiconductor laser elements provided in the package; a member having a plurality of mounting surfaces on which the semiconductor laser elements are mounted, the mounting surfaces being separated from a bottom surface of the package by respective distances, the distances being gradually different from each other in a manner that the mounting surfaces as a whole form a step-like form; a plurality of lenses collimating respective laser beams emitted from the semiconductor laser elements; a plurality of reflection mirrors reflecting the respective laser beams; a condenser lens unit condensing the laser beams; an optical fiber where the optical beams condensed by the condenser lenses are optically coupled; and an optical filter disposed on optical lines of the respective laser beams reflected by the reflection mirrors and reflecting light having wavelengths different from the wavelengths of the laser beams.

公开(公告)号：US10050409B2

公开(公告)日：2018-08-14

申请号：US15894170

申请日：2018-02-12

申请人： Innovative Micro Technology

发明人： Christopher S. Gudeman

IPC分类号： H04B10/00 ,  H01S5/02 ,  B81B7/00 ,  B81C1/00 ,  H01S5/022 ,  H01S5/40 ,  H04J14/02 ,  H04B10/40 ,  H01S5/00 ,  H04J14/00

CPC分类号： H01S5/0206 ,  B81B7/0067 ,  B81C1/00301 ,  H01S5/0064 ,  H01S5/02216 ,  H01S5/02248 ,  H01S5/02284 ,  H01S5/02288 ,  H01S5/02292 ,  H01S5/02296 ,  H01S5/4025 ,  H01S5/4087 ,  H04B10/40 ,  H04B10/506 ,  H04J14/02

摘要： A microfabricated optical apparatus that includes a light source driven by a waveform, wherein the waveform is delivered to the light source by at least one through silicon via. The microfabricated optical apparatus may also include a light-sensitive receiver which generates an electrical signal in response to an optical signal. The electrical signal may be communicated to external devices by at least one additional through silicon via, and the signals routed to the encapsulated devices by metal traces. The vias may couple a ground plane to a metal trace layer at intervals, effectively quashing the ability of the bondline to interfere with the absorbed or radiated signal frequency.

公开(公告)号：US20180123321A1

公开(公告)日：2018-05-03

申请号：US15638859

申请日：2017-06-30

申请人： Lumentum Operations LLC

发明人： Michael AYLIFFE ,  Yuliya AKULOVA ,  Claude GAMACHE

IPC分类号： H01S5/40 ,  H01S5/022 ,  H01S5/00 ,  H01S5/183 ,  H01S5/026

CPC分类号： H01S5/4075 ,  H01S5/005 ,  H01S5/0064 ,  H01S5/0071 ,  H01S5/0224 ,  H01S5/02248 ,  H01S5/02252 ,  H01S5/02288 ,  H01S5/02292 ,  H01S5/0267 ,  H01S5/18388 ,  H01S5/4025 ,  H01S5/4056 ,  H01S5/4087

摘要： An optical device may include a semiconductor laser chip to independently generate four laser beams at different wavelengths. Each laser beam, of the four laser beams, may be directed to a respective optical output of the optical device with a sub-micron level of tolerance of each laser beam relative to the respective optical outputs of the optical device, and each laser beam, of the four laser beams, may be associated with a different optical path from the semiconductor laser chip to the respective optical output of the optical device. The optical device may include a lens to receive each of the four laser beams. The lens may be positioned to direct each laser beam, of the four laser beams, toward the respective optical output of the optical device. The optical device may include an optical isolator to receive each of the four laser beams.