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公开(公告)号：US20230118584A1
公开(公告)日：2023-04-20
申请号：US17990447
申请日：2022-11-18
Applicant: Huawei Technologies Co., Ltd.
Inventor： Yongtao CUI , Yuchan YANG , Rong MA , Heshuai SI
Abstract: Embodiments of this application provide an enclosure structure, an electronic device, and an enclosure structure preparation method; and relate to the field of electronic device technologies. The enclosure structure includes an enclosure and an antenna grain line. At least a part of the enclosure is made of a non-metal material to form a non-metal part, the non-metal part has a first surface and a second surface that are opposite to each other, the first surface faces an exterior of the electronic device, and the second surface faces an interior of the electronic device. The antenna grain line is disposed on the first surface; or a groove is disposed on the second surface, and the antenna grain line is disposed in the groove.
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公开(公告)号：US20220329677A1
公开(公告)日：2022-10-13
申请号：US17642351
申请日：2020-09-11
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Guoping WU , Liang MA , Siwei WANG , Guangxiang ZHU , Chengjie GAO , Yuchan YANG , Huan WANG
Abstract: Embodiments of this application provide a middle frame, a rear cover, and fabrication methods thereof, and an electronic device. The electronic device may include a mobile or fixed terminal with a frame or a housing, such as a mobile phone, a tablet computer, a notebook computer, an ultra-mobile personal computer (UMPC), a handheld computer, a walkie-talkie, a netbook, a POS terminal, a personal digital assistant (PDA), an event data recorder, a wearable device, a virtual reality device, a wireless USB flash drive, a Bluetooth speaker/headset, or a vehicle-mounted device. Ceramics and fiber reinforced composite are used to form frames of a rear cover and a middle frame, to reduce thicknesses of a ceramic outer housing and a ceramic outer frame, thereby reducing a weight of the electronic device.
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