公开(公告)号：US20120261870A1

公开(公告)日：2012-10-18

申请号：US13444046

申请日：2012-04-11

申请人： Hao-Chun HSIEH ,  Sheng-Wen Cheng ,  Hsin-Lun Tsai ,  Chia-Hsien Lee

发明人： Hao-Chun HSIEH ,  Sheng-Wen Cheng ,  Hsin-Lun Tsai ,  Chia-Hsien Lee

IPC分类号： B25B11/00 ,  B23P11/00

CPC分类号： H05K3/007 ,  H05K2201/083 ,  H05K2201/09063 ,  H05K2203/0165 ,  Y10T29/49895

摘要： A printed circuit board, a supporting jig, and a positioning method are disclosed, wherein the supporting jig is used for positioning a printed circuit board to facilitate surface mount technology (SMT) procedures. The printed circuit board includes a circuit board locating hole, and a first magnet, wherein the first magnet is accommodated in the circuit board locating hole. The supporting jig has a jig locating hole and a second magnet. The jig locating hole is beneath the circuit board locating hole. The second magnet is accommodated in the jig locating hole so that the printed circuit board can be fixed on the supporting jig by the magnetic attraction between the first magnet and the second magnet.

摘要翻译： 公开了一种印刷电路板，支撑夹具和定位方法，其中支撑夹具用于定位印刷电路板以便于表面贴装技术（SMT）工艺。 印刷电路板包括电路板定位孔和第一磁体，其中第一磁体容纳在电路板定位孔中。 支撑夹具具有夹具定位孔和第二磁体。 夹具定位孔位于电路板定位孔的下方。 第二磁体容纳在夹具定位孔中，使得印刷电路板可以通过第一磁体和第二磁体之间的磁吸引力固定在支撑夹具上。

公开(公告)号：US20120090652A1

公开(公告)日：2012-04-19

申请号：US13113495

申请日：2011-05-23

申请人： Hao-Chun HSIEH ,  Hsin-Lun Tasi ,  Chia-Hsien Lee

发明人： Hao-Chun HSIEH ,  Hsin-Lun Tasi ,  Chia-Hsien Lee

IPC分类号： B08B5/02

CPC分类号： B08B5/02

摘要： The cleaning apparatus for solder paste in apertures according to the present invention comprises a stencil, a guiding plate, and a blower. The stencil has a plurality of apertures with residual solder paste on the sidewalls thereof. The guiding plate is disposed above the stencil and has a plurality of wind-guiding pillars and a plurality of wind-guiding holes. The locations of the wind-guiding pillars are opposite to the locations of the apertures; the wind-guiding holes are located around the wind-guiding pillars. The blower is disposed above the guiding plate and provides a gas to the guiding plate. The gas is guided into the apertures by means of the wind-guiding pillars and the wind-guiding holes and pushes completely the solder paste therein out. Thereby, accumulation of solder paste in the sidewalls of the apertures can be avoided. Consequently, deterioration of adhesion of electronic components caused by fewer amount of solder paste printed on the carrier can be prevented.

摘要翻译： 根据本发明的孔中的焊膏清洁装置包括模板，引导板和鼓风机。 模板在其侧壁上具有多个具有残留焊膏的孔。 引导板设置在模板上方，并具有多个引导支柱和多个导风孔。 导风柱的位置与孔的位置相反; 导风孔位于导风柱周围。 鼓风机设置在引导板上方，并向引导板提供气体。 气体通过导风柱和导风孔被引导到孔中，并将其中的焊膏完全推出。 因此，可以避免焊膏在孔的侧壁中的积聚。 因此，可以防止由较少量印刷在载体上的焊膏引起的电子部件的附着力劣化。