公开(公告)号：US11950378B2

公开(公告)日：2024-04-02

申请号：US17401810

申请日：2021-08-13

申请人： Harbor Electronics, Inc.

发明人： Sergio Ramirez ,  Benjamin Norris ,  Paul Diehl ,  Chris Cuda

IPC分类号： H05K3/00 ,  G01R3/00 ,  H01R12/52 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46

CPC分类号： H05K3/462 ,  G01R3/00 ,  H01R12/523 ,  H05K3/0032 ,  H05K3/4069 ,  H05K3/4638 ,  H05K2203/068 ,  H05K2203/1131

摘要： A method for attaching two electronics boards, e.g., a testing PCB and a space transformer, comprises rack welding resin prepreg and a mylar film to a testing PCB; laser drilling via holes in the resin prepreg and mylar film such that the holes are aligned on one side of the resin prepreg with connection/capture pads on the testing PCB and aligned (after attachment) on the other side of the resin prepreg with connection capture pads on a space transformer, filling the via holes with sintering paste; applying a pressure treatment to remove air, bubbles, and voids from the sintering paste; removing the mylar film; and using a lamination press cycle to attach a space transformer to the resin prepreg.

公开(公告)号：US20230053225A1

公开(公告)日：2023-02-16

申请号：US17401810

申请日：2021-08-13

申请人： Harbor Electronics, Inc.

发明人： Sergio Ramirez ,  Benjamin Norris ,  Paul Diehl ,  Chris Cuda

IPC分类号： H05K3/46 ,  H01R12/52 ,  H05K3/00 ,  H05K3/40 ,  G01R3/00

摘要： A method for attaching two electronics boards, e.g., a testing PCB and a space transformer, comprises rack welding resin prepreg and a mylar film to a testing PCB; laser drilling via holes in the resin prepreg and mylar film such that the holes are aligned on one side of the resin prepreg with connection/capture pads on the testing PCB and aligned (after attachment) on the other side of the resin prepreg with connection capture pads on a space transformer, filling the via holes with sintering paste; applying a pressure treatment to remove air, bubbles, and voids from the sintering paste; removing the mylar film; and using a lamination press cycle to attach a space transformer to the resin prepreg.