公开(公告)号：US06616774B2

公开(公告)日：2003-09-09

申请号：US09961682

申请日：2001-09-24

申请人： Haruki Sonoda ,  Kazuto Nishizaki ,  Tetsuji Oishi ,  Masatoshi Hirokawa ,  Ei-Ichi Ando ,  Yusuke Abe ,  Masashi Omori

发明人： Haruki Sonoda ,  Kazuto Nishizaki ,  Tetsuji Oishi ,  Masatoshi Hirokawa ,  Ei-Ichi Ando ,  Yusuke Abe ,  Masashi Omori

IPC分类号： B08B702

CPC分类号： H01L21/67057 ,  H01L21/67781 ,  Y10S134/902 ,  Y10S438/906

摘要： There are provided a band-shaped tray 12 having grasping grooves 12a for grasping opposite side ends of wafers 1, and a cleaning tank 20 to which the wafers 1 inserted in the tray 12 are conveyed by a conveyor robot 2 to be cleaned. The cleaning tank 20 is provided with guides 22 for mounting the tray 12 in the tank, a bottom portion 26 formed substantially in V-shape conforming to the bottom-face shape of the wafer 1, and flow ports 24 via which cleaning fluid is supplied into the tank. An outer side face of the cleaning tank 20 is provided with an overflow tank 30 for containing the cleaning fluid overflowing from the cleaning tank 20, and the overflow tank 30 is provided with a circulation line 32 for circulating the cleaning fluid again into the cleaning tank 20.

摘要翻译： 提供了带状托盘12，其具有用于抓握晶片1的相对侧端的把持槽12a和清洁槽20，插入托盘12中的晶片1由输送机器人2输送到清洗槽20。 清洗槽20设置有用于将托盘12安装在罐中的引导件22，基本上形成为符合晶片1的底面形状的V形的底部26，以及通过其供应清洁流体的流动端口24 进入坦克 清洗槽20的外侧面设置有用于容纳从清洗槽20溢出的清洗液的溢流槽30，溢流槽30设有循环管线32，用于将清洗液再次循环到清洗槽 20。