Abstract:
Provided are a high strength thin steel sheet having tensile strength of about 800 MPa or more, and a manufacturing method thereof. The thin steel sheet is mainly used for construction materials, home appliances, and automobiles. The thin steel sheet has excellent plating characteristic, welding characteristic, bending workability, and hole expansion ratio. The thin steel sheet includes, in weight %, C: 0.02-0.20%, Si: 1.5% or less, Mn: 1.5-3.0%, P: 0.001-0.10%, S: 0.010% or less, SoLAl: 0.01-0.40%, N: 0.020% or less, Cr: 0.3-1.5%, B: 0.0010-0.0060%, Sb: 0.001-0.10%, and including at least one material selected from the group consisting of Ti: 0.003-0.08%, Nb: 0.003-0.08%, and Mo: 0.003-0.08%, and includes Fe and other inevitable impurities as a remainder. Here, Si, Mn, B, Sb, P, and S meet conditions of 5
Abstract:
A self-refresh apparatus for a semiconductor memory device is disclosed. According to the self-refresh apparatus, Data loss can be prevented by monitoring a leakage of memory cell data, activating a variable self-refresh signal in accordance with a signal resulted from the monitoring during a self-refresh mode, producing a refresh request signal when the self-refresh signal is activated and then refreshing all of memory cells. An unnecessary power consumption can be also prevented by variably performing the refresh operation in accordance with the retention time of cell data.
Abstract:
An internal voltage generating circuit and method for generating thereof in semiconductor device capable of performing test without any needless transfer between a test equipment and a repair equipment are disclosed. The circuit includes a plurality of test power voltage pads, each of which can be selectively applied with the external power voltage and a ground voltage during test; a fuse programmable control signal generator coupled to the plurality of test power voltage pads for generating a control signal according to the signals applied to the plurality of the test power voltage pads during test, and for generating the control signal according to fuse-programmed state after at least one fuse included therein is programmed; a reference voltage generator for receiving the external power voltage so as to produce a reference voltage having a predetermined level; and a voltage trimming unit for trimming the reference voltage in accordance with the output of the fuse programmable control signal generator.
Abstract:
A steel sheet for forming having low-temperature heat treatment property, in which heat treatment is performed within a range of lower temperature than a conventional steel sheet in the event of hot press forming or post-heat treatment after cold forming, a method of manufacturing the same, and a method of manufacturing parts using the same. The steel sheet has a composition of, by weight, carbon (C): 0.15 to 0.35%, silicon (Si): 0.5% or less, manganese (Mn): 1.5 to 2.2%, phosphorus (P): 0.025% or less, sulfur (S): 0.01% or less, aluminum (Al): 0.01 to 0.05%, nitrogen (N): 50 to 200 ppm, titanium (Ti): 0.005 to 0.05%, tungsten (W): 0.005 to 0.1%, and boron (B): 1 to 50 ppm, wherein Ti/N: less than 3.4, where Ti/N is the atomic ratio of the corresponding elements, Ceq expressed by the following formula ranges from 0.48 to 0.58, and temperature Ar3 ranges from 670° C. to 725° C. Wherein Ceq C+Si/24+Mn/6+Ni/40+Cr/5+V/14 where C, Si, Mn, Ni, Cr and V indicate the contents (wt %) of the respective elements.
Abstract:
A steel sheet for forming having low-temperature heat treatment property, in which heat treatment is performed within a range of lower temperature than a conventional steel sheet in the event of hot press forming or post-heat treatment after cold forming, a method of manufacturing the same, and a method of manufacturing parts using the same. The steel sheet has a composition of, by weight, carbon (C): 0.15 to 0.35%, silicon (Si): 0.5% or less, manganese (Mn): 1.5 to 2.2%, phosphorus (P): 0.025% or less, sulfur (S): 0.01% or less, aluminum (Al): 0.01 to 0.05%, nitrogen (N): 50 to 200 ppm, titanium (Ti): 0.005 to 0.05%, tungsten (W): 0.005 to 0.1%, and boron (B): 1 to 50 ppm, wherein Ti/N: less than 3.4, where Ti/N is the atomic ratio of the corresponding elements, Ceq expressed by the following formula ranges from 0.48 to 0.58, and temperature Ar3 ranges from 670° C. to 725° C. Wherein Ceq=C+Si/24+Mn/6+Ni/40+Cr/5+V/14 where C, Si, Mn, Ni, Cr and V indicate the contents (wt %) of the respective elements.
Abstract:
A semiconductor memory test circuit and a method for the same to reduce the test time in testing a semiconductor memory. The semiconductor memory test circuit includes: a parallel test circuit for performing a parallel test when inputting a battery backup signal (bbu), a column address signal (cas5), a CAS before RAS signal (cbr), a write enable signal (ew), a power-up bar signal (pwrupb), and a row address signal (ras71)); and a test mode circuit which is controlled by a combination of a parallel test signal (pt) and the battery backup signal (bbu) generated from the parallel test circuit, and generates a test time reduction signal (ttrb), whereby the semiconductor memory test circuit compresses one least significant bit indicating a row address of a device in the case of a 4K refresh operation when the test time reduction signal (ttrb) is enabled, and compresses two least significant bits indicating a row address of a device in the case of an 8K refresh operation when the test time reduction signal (ttrb) is enabled.
Abstract:
An antifuse repair circuit is disclosed for selectively programming a specific antifuse to replace a defective cell with a redundant cell. The antifuse repair circuit includes: (a) a special test mode decoder for selecting an antifuse box according to an address signal; (b) a bank selector for selecting an antifuse bank according to the output signal from the special test mode decoder and the address signal; (c) a special address multiplexer for selecting a specific antifuse within an antifuse bank selected by the bank selector according to the output signal from the bank selector and the address signal; (d) a negative voltage generator for generating a negative voltage to program an antifuse device; (e) a power-up detector for detecting the supply voltage to generate a plurality of control signals in order to detect whether the antifuse device is programmed; (f) a unit antifuse circuit for programming the antifuse device according to the signals from the special test mode detector, the special address multiplexer, the negative voltage generator and the power-up detector; and (g) a repair circuit responsive to the output signal from the unit antifuse circuit and an external control signal to replace a defective cell with a redundant cell.
Abstract:
The anti-fuse circuit includes three sub-blocks: a multiplexer having inputs of control signals and addresses and yielding the activation of a programming signal and program addresses; a programming voltage generator consisting of an oscillator and a charge pump; and an anti-fuse unit circuits for the program/read of anti-fuse states. For an anti-fuse program at the special test mode, a program address generation circuit having inputs of control signals and addresses activates the programming voltage generator and makes a special or program address for selection of anti-fuse. In the normal mode, the program address generation circuit and an internal power generator remain at an inactive state. In anti-fuse unit circuit, the program address and the programming voltage signal from the programming voltage generator serve to switch the terminal of the anti-fuse up to a programming voltage level when the anti-fuse is selected for programming of anti-fuse elements.