公开(公告)号：US20220306919A1

公开(公告)日：2022-09-29

申请号：US17806768

申请日：2022-06-14

Applicant: Henkel AG & Co.,KGaA

Inventor： Adrian Brandt ,  Horst Beck ,  Alexander Kux ,  Kerstin Schroeder ,  Christoph Lohr ,  Andrea Brenger ,  Nils Hellwig ,  Mathias Schriefers ,  Anna kaulisch ,  Jennifer Schmidt

IPC: C09J175/06 ,  C09J11/04 ,  C08G18/73 ,  C08G18/32

Abstract: The present invention relates to a dimensionally stable adhesive compound which is formulated so as to be largely water- and solvent-free and can be brought into contact with the substrate to be bonded by being wiped on in the form of a thin adhesive film that is suitable in particular for bonding materials obtained from plant fibers. The organic constituent of the adhesive compound according to the invention consists predominantly of polyester polyurethanes, at least some of which are based on semi-crystalline polyester polyols. The invention also relates to a method for applying a tacky film to a planar substrate, preferably to paper, by wiping the adhesive compound onto the point of contact with the substrate.

公开(公告)号：US20220306918A1

公开(公告)日：2022-09-29

申请号：US17806752

申请日：2022-06-14

Applicant: Henkel AG & Co., KGaA

Inventor： Adrian Brandt ,  Horst Beck ,  Alexander Kux ,  Kerstin Schroeder ,  Christoph Lohr ,  Andrea Brenger ,  Nils Hellwig ,  Mathias Schriefers ,  Anna Kaulisch ,  Jennifer Schmidt

IPC: C09J175/06 ,  C08K3/013 ,  C09J11/04 ,  C09J7/38

Abstract: The present invention relates to a dimensionally stable adhesive compound which is formulated so as to be largely water- and solvent-free and can be brought into contact with the substrate to be bonded by being wiped on in the form of a thin adhesive film that is suitable in particular for bonding materials obtained from plant fibers. The organic constituent of the adhesive compound according to the invention consists predominantly of a mixture of polyether polyurethanes which are end-capped with at least two monohydric aliphatic alcohols of different chain lengths. The invention also relates to a method for applying a tacky film to a planar substrate, preferably to paper, by wiping the adhesive compound onto the point of contact with the substrate.