公开(公告)号：US12071448B2

公开(公告)日：2024-08-27

申请号：US17003669

申请日：2020-08-26

Applicant: Henkel AG & Co. KGaA

Inventor： Adrian Brandt ,  Horst Beck ,  Johann Klein ,  Jan-Erik Damke ,  Sebastian Schmidt ,  Alexander Kux ,  Johannes Gerardus de Vries ,  Sandra Hinze ,  Richard van Heck

IPC: C07F7/18 ,  C08G61/04 ,  C09J171/02

CPC classification number: C07F7/1892 ,  C07F7/1804 ,  C08G61/04 ,  C09J171/02

Abstract: The present invention pertains to reactive (moisture curing) plasticizers; adhesives and sealants containing the plasticizers and methods of bonding and sealing substrates with adhesives and sealants containing the plasticizers.